S. Dabral
发表
A. Wang,
Ying Cao,
S. D. Vamvakos,
2012,
2012 IEEE 55th International Midwest Symposium on Circuits and Systems (MWSCAS).
Timothy J. Maloney,
S. Dabral,
1995
.
S. Dabral,
S. Chaudhuri,
W. Anderson,
2006,
2006 IEEE Electrical Performane of Electronic Packaging.
John F. McDonald,
S. Dabral,
R. Philhower,
1990,
1990 Proceedings. International Conference on Wafer Scale Integration.
S. Dabral,
T.J. Maloney,
T. Maloney,
1996,
Electrical Overstress/Electrostatic Discharge Symposium Proceedings.
S. Dabral,
S. Chaudhuri,
K.S. Canagasaby,
2004,
Electrical Performance of Electronic Packaging - 2004.
John F. McDonald,
S. Dabral,
H. Greub,
1988
.
S. Dabral,
J.F. McDonald,
R. Philhower,
1992,
[1992] Proceedings International Conference on Wafer Scale Integration.
John F. McDonald,
S. Dabral,
Xin Zhang,
1993,
Other Conferences.
Timothy J. Maloney,
S. Dabral,
R. Aslett,
1994
.
S. Dabral,
S. Chaudhuri,
E. Yeung,
2006,
2006 Symposium on VLSI Circuits, 2006. Digest of Technical Papers..
S. Dabral,
K.S. Canagasaby,
S. Rajagopalan,
2002,
Electrical Performance of Electronic Packaging,.
S. Dabral,
N. Majid,
J. F. McDonald,
1989
.