Majid Samavatian

Improving the reliability of ball grid arrays under random vibration by optimization of module design

Alireza Kokabi, Vahid Samavatian, Lubov K. Ilyashenko, 2020 .

Effect of solder layer thickness on thermo-mechanical reliability of a power electronic system

Andino Maseleno, Vahid Samavatian, Aygul Z. Ibatova, 2018, Journal of Materials Science: Materials in Electronics.

Effects of Creep Failure Mechanisms on Thermomechanical Reliability of Solder Joints in Power Semiconductors

Yvan Avenas, Hossein Iman-Eini, Vahid Samavatian, 2020, IEEE Transactions on Power Electronics.

Effect of stress triaxiality on damage evolution of porous solder joints in IGBT Discretes

Hadi Babaei, Vahid Samavatian, Majid Samavatian, 2018 .