Reiner Gotzen

Millimeter-Wave Surface Mount Technology for 3-D Printed Polymer Multichip Modules

Thomas Merkle, Reiner Gotzen, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Polymer Multichip Module Process Using 3-D Printing Technologies for D-Band Applications

Thomas Merkle, Joo-Young Choi, Reiner Gotzen, 2015, IEEE Transactions on Microwave Theory and Techniques.

Inkjet printing of electrical vias

Werner Zapka, Ingo Reinhold, Reiner Gotzen, 2011, 18th European Microelectronics & Packaging Conference.