Geraldine Jamieson

Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling

W. Li, A. Vandooren, Liesbeth Witters, 2018, 2018 International Conference on IC Design & Technology (ICICDT).

Die to wafer 3D stacking for below 10um pitch microbumps

Teng Wang, Eric Beyne, Anne Jourdain, 2016, 2016 IEEE International 3D Systems Integration Conference (3DIC).

Highly Scaled Ruthenium Interconnects

Christopher J. Wilson, Christoph Adelmann, Jürgen Bömmels, 2017, IEEE Electron Device Letters.

"Hole-in-One TSV", a New Via Last Concept for High Density 3D-SOC Interconnects

Eric Beyne, Anne Jourdain, Andy Miller, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Ruthenium interconnects with 58 nm2 cross-section area using a metal-spacer process

Christopher J. Wilson, Christoph Adelmann, Jürgen Bömmels, 2017, 2017 IEEE International Interconnect Technology Conference (IITC).

Integration of etched facet, electrically pumped, C-band Fabry-Pérot lasers on a silicon photonic integrated circuit by transfer printing.

Sarah Uvin, Joris Van Campenhout, Dries Van Thourhout, 2018, Optics express.

3D stacking using bump-less process for sub 10 µm pitches

Eric Beyne, Anne Jourdain, Andy Miller, 2016, ECTC 2016.

Low temperature zero-level hermetic packaging for MEMS based on solder and polymer bonding

Chris Van Hoof, Anne Jourdain, Ann Witvrouw, 2003 .