Alfred Yeo

A methodology for package to test interaction study

Jie Huang, Han Guan Tan, Lay Peng Ng, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

Friction wear test evaluation for assembly tool

Alfred Yeo, Ong Chen Ho, Tan Han Guan, 2016, 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).

Influence of package lead type onto final test contacting

Yang Kai, Alfred Yeo, Tan Han Guan, 2016, 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).

Consideration of temperature and current stress testing on flip chip solder interconnects

Bernd Ebersberger, Alfred Yeo, Charles Lee, 2008, Microelectron. Reliab..

A novel damage test evaluation of IC bond pad stack strength

Alfred Yeo, Georg M. Reuther, Eric Yong, 2013, 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).

Characterization of dicing tape adhesion for ultra-thin die pick-up process

Julie Chew, Alfred Yeo, Y. Sing Chan, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).