J.-M. Dorkel

Thermal modeling for electrothermal simulation of power devices or circuits

P. Leturcq, P. Tounsi, J.-M. Dorkel, 2002 .

Three-dimensional thermal modeling based on the two-port network theory for hybrid or monolithic integrated power circuits

P. Leturcq, P. Tounsi, J.-M. Dorkel, 1996 .

Improved 3D-nonlinear compact modelling for power components

W. Habra, P. Tounsi, J.-M. Dorkel, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

A new methodology for extraction of dynamic compact thermal models

W. Habra, P. Tounsi, F. Madrid, 2007, 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC).

Analysis and compact modeling of a vertical grounded-base NPN bipolar transistor used as an ESD protection in a smart power technology

Philippe Perdu, Nicolas Mauran, Nicolas Nolhier, 2000, Proceedings of the 2000 BIPOLAR/BiCMOS Circuits and Technology Meeting (Cat. No.00CH37124).