R. Aschenbrenner
发表
Frank Ansorge,
H. Reichl,
K.-F. Becker,
2001
.
R. Aschenbrenner,
2008,
2008 International Conference on Electronic Packaging Technology & High Density Packaging.
H. Reichl,
R. Aschenbrenner,
T. Braun,
2007,
2007 8th International Conference on Electronic Packaging Technology.
C. Landesberger,
Andreas Ostmann,
Herbert Reichl,
2002,
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium.
R. Aschenbrenner,
T. Braun,
R. Jordan,
2013,
2013 10th China International Forum on Solid State Lighting (ChinaSSL).
R. Aschenbrenner,
T. Braun,
M. Töpper,
2018,
2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM).
R. Aschenbrenner,
D. Manessis,
A. Ostmann,
2012,
2012 4th Electronic System-Integration Technology Conference.
R. Aschenbrenner,
K.-F. Becker,
H. Reichl,
1997,
Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307).
H. Reichl,
R. Aschenbrenner,
T. Braun,
2004,
4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004..
R. Aschenbrenner,
T. Braun,
J. Bauer,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Frank Ansorge,
H. Reichl,
Bernd Michel,
2001
.
H. Reichl,
R. Aschenbrenner,
C. Kallmayer,
2009,
2009 11th Electronics Packaging Technology Conference.
K. Schischke,
T. Krivec,
R. Aschenbrenner,
2017,
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.
R. Aschenbrenner,
T. Braun,
K.-F. Becker,
2012,
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
H. Reichl,
R. Aschenbrenner,
K.-F. Becker,
2007,
2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium.
R. Aschenbrenner,
2006,
2006 7th International Conference on Electronic Packaging Technology.
Herbert Reichl,
R. Aschenbrenner,
Christine Kallmayer,
2000,
Design, Test, Integration, and Packaging of MEMS/MOEMS.
H. Reichl,
R. Aschenbrenner,
A. Ostmann,
2006,
2006 International Microsystems, Package, Assembly Conference Taiwan.
H. Reichl,
R. Aschenbrenner,
Joachim Kloeser,
2000
.
R. Aschenbrenner,
D. Hornig,
R. Enand,
1991,
Conference Record AUTOTESTCON '91 IEEE Systems Readiness Technology Conference Improving Systems Effectiveness in the Changing Environment of the '90s.
R. Aschenbrenner,
D. Manessis,
A. Ostmann,
2013,
2013 Eurpoean Microelectronics Packaging Conference (EMPC).
Andreas Ostmann,
Herbert Reichl,
R. Aschenbrenner,
2002,
4th Electronics Packaging Technology Conference, 2002..
R. Aschenbrenner,
T. Braun,
J. Bauer,
2014,
2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Klaus-Dieter Lang,
R. Aschenbrenner,
Steve Voges,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Andreas Ostmann,
J. Bauer,
R. Aschenbrenner,
2011
.
H. Reichl,
R. Aschenbrenner,
T. Braun,
2004,
IEEE Transactions on Advanced Packaging.
H. Reichl,
R. Aschenbrenner,
T. Braun,
2003
.
Herbert Reichl,
R. Aschenbrenner,
E. Jung,
2003
.
H. Reichl,
R. Aschenbrenner,
A. Ostmann,
2004,
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
R. Aschenbrenner,
S. Karaszkiewicz,
D. Manessis,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
H. Reichl,
R. Aschenbrenner,
M. Klein,
1998
.
Andreas Ostmann,
Herbert Reichl,
R. Aschenbrenner,
1995
.
J. Bauer,
R. Aschenbrenner,
K.-D. Lang,
2016
.
R. Aschenbrenner,
Christine Kallmayer,
R. Pisarek,
2003,
53rd Electronic Components and Technology Conference, 2003. Proceedings..
Klaus-Dieter Lang,
R. Aschenbrenner,
Steve Voges,
2018,
2018 International Wafer Level Packaging Conference (IWLPC).
R. Aschenbrenner,
R. Miessner,
2000,
4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431).
Frank Ansorge,
Herbert Reichl,
R. Aschenbrenner,
1998,
Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204).
R. Aschenbrenner,
K.-F. Becker,
O. Hoelck,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
M. Kaynak,
M. Wietstruck,
R. Aschenbrenner,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Herbert Reichl,
R. Aschenbrenner,
Joachim Kloeser,
1999,
Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330).
J. Bauer,
R. Aschenbrenner,
T. Braun,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
J. Bauer,
R. Aschenbrenner,
T. Braun,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
H. Reichl,
R. Aschenbrenner,
T. Braun,
2006,
2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.
Herbert Reichl,
R. Aschenbrenner,
Christine Kallmayer,
2001,
Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).
H. Reichl,
R. Aschenbrenner,
A. Ostmann,
2009,
2009 11th Electronics Packaging Technology Conference.
H. Reichl,
R. Aschenbrenner,
G. Elger,
2002
.
J. Bauer,
R. Aschenbrenner,
T. Braun,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
H. Reichl,
R. Aschenbrenner,
D. Manessis,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
Herbert Reichl,
R. Aschenbrenner,
Eberhard Kaulfersch,
1998,
1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
R. Aschenbrenner,
T. Braun,
M. Topper,
2016,
2016 IEEE 16th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF).
Ark L. Lew,
R. Aschenbrenner,
Elbert Nhan,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
R. Aschenbrenner,
T. Braun,
M. Topper,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
Herbert Reichl,
R. Aschenbrenner,
R. Miessner,
1999,
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).
H. Reichl,
R. Aschenbrenner,
T. Braun,
2005,
IEEE Transactions on Electronics Packaging Manufacturing.
Herbert Reichl,
R. Aschenbrenner,
Joachim Kloeser,
1998,
Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204).
R. Aschenbrenner,
T. Braun,
K.-F. Becker,
2018,
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
H. Reichl,
R. Aschenbrenner,
S. Anhock,
1998,
Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204).
Andreas Ostmann,
Herbert Reichl,
R. Aschenbrenner,
1995,
Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium.
H. Reichl,
R. Aschenbrenner,
A. Ostmann,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
Microtechnology For Realization Of Dielectrophoresis Enhanced Microwells For Biomedical Applications
R. Guerrieri,
H. Reichl,
J. Bauer,
2007,
2007 9th Electronics Packaging Technology Conference.
H. Reichl,
R. Aschenbrenner,
A. Ostmann,
2001,
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).
Andreas Ostmann,
Herbert Reichl,
R. Aschenbrenner,
2003,
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
H. Reichl,
R. Aschenbrenner,
Christine Kallmayer,
1998,
1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
Andreas Ostmann,
Herbert Reichl,
R. Aschenbrenner,
1994,
Proceedings of the International Conference on Multichip Modules.
H. Reichl,
R. Aschenbrenner,
B. Pahl,
2005,
2005 7th Electronic Packaging Technology Conference.
J. Bauer,
R. Aschenbrenner,
T. Braun,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
H. Reichl,
R. Aschenbrenner,
T. Braun,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
H. Reichl,
R. Aschenbrenner,
J. Kloeser,
1995,
Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium.