L.W. Schaper

Architectural implications and process development of 3-D VLSI Z-axis interconnects using through silicon vias

Z. Rahman, L.W. Schaper, S.L. Burkett, 2005, IEEE Transactions on Advanced Packaging.

Advanced decoupling in high performance IC packaging

L.W. Schaper, D. Mannath, R.K. Ulrich, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).