Man-Ping Cai

Characterization of EUV resists for defectivity at 32nm

Eric Hendrickx, Doron Meshulach, Shimon Levi, 2011, Advanced Lithography.

EUV defect characterization study on post litho and etch for 1x and 2x node processes

Chris Ngai, Ofir Montal, Ido Dolev, 2011, Advanced Lithography.

Demonstration of 32nm half-pitch electrical testable NAND FLASH patterns using self-aligned double patterning

Ping Xu, Huixiong Dai, Chris Ngai, 2009, Advanced Lithography.

Use of test structures for Cu interconnect process development and yield enhancement

Man-Ping Cai, A. Skumanich, J. Educato, 2000, ICMTS 2000. Proceedings of the 2000 International Conference on Microelectronic Test Structures (Cat. No.00CH37095).

Sub-20 nm trench patterning with a hybrid chemical shrink and SAFIER process

Hao Chen, Yijian Chen, Man-Ping Cai, 2009, Advanced Lithography.

Small particle defect characterization on critical layers of 22nm Spacer Self-Aligned Double Patterning (SADP)

Chris Ngai, Saar Shabtay, Kfir Dotan, 2012, Advanced Lithography.

Fin Doping by Hot Implant for 14nm FinFET Technology and Beyond

Man-Ping Cai, Shashank Sharma, Motoya Okazaki, 2013 .