J. Lam

Backside Fault Isolation Technique in 0.13μm and 90nm Product Prototyping

D. Brown, Wang Qinfang, Mai Zhihong, 2006, 2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits.

In-Depth Electrical Analysis to Reveal the Failure Mechanisms With Nanoprobing

Q.F. Wang, P. K. Tan, H. Tan, 2008, IEEE Transactions on Device and Materials Reliability.

Use of Nanoprobing as the Diagnostic Tool for Nanoscaled Devices

Q.F. Wang, P. K. Tan, H. Tan, 2007, 2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Study on the poly bump defect by TEM failure analysis

J. Lam, E. Er, C. W. Soo, 2015, 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Failure analysis methodology for the localization of thin and ultra-thin metal barrier residue

G. B. Ang, Z. H. Mai, A. C. T. Quah, 2014, Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Failure mechanism analysis and process improvement on time-dependent dielectric breakdown of Cu/ultra-low-k dielectric based on complementary Raman and FTIR spectroscopy study

Z. H. Mai, D. D. Wang, J. Lam, 2014, 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW).