W. John
发表
C. Wiegand,
Lj. Radic-Weissenfeld,
C. Hedayat,
2007,
2007 18th International Zurich Symposium on Electromagnetic Compatibility.
G. Sommer,
W. John,
Faical Salhi,
2005,
Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005..
H. Reichl,
G. Sommer,
W. John,
2004,
Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects.
M. Schinkel,
S. Guttowski,
H. Reichl,
2006,
Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06..
W. Mathis,
C. Wiegand,
C. Hedayat,
2007,
2007 IEEE International Symposium on Electromagnetic Compatibility.
W. John,
M. Taki,
2007,
2007 IEEE International Symposium on Electromagnetic Compatibility.
U. Hilleringmann,
C. Hedayat,
W. John,
2007,
2007 18th International Zurich Symposium on Electromagnetic Compatibility.
O. Rethmeier,
W. John,
1990
.
W. John,
M. Taki,
2005,
2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005..
H. Reichl,
G. Sommer,
W. John,
2004,
Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects.
C. Hedayat,
W. John,
M. Taki,
2008,
2008 IEEE International Symposium on Electromagnetic Compatibility.
U. Hilleringmann,
C. Wiegand,
C. Hedayat,
2007,
2007 IEEE International Symposium on Electromagnetic Compatibility.
S. Guttowski,
H. Reichl,
E. Hoene,
2003,
2003 IEEE International Symposium on Electromagnetic Compatibility, 2003. EMC '03..
Gerd Mrozynski,
W. John,
S. Öing,
1991
.
W. Mathis,
G. Sommer,
W. John,
2003,
Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710).
Development of a design library for embedded passive RF components in HDI organic substrate material
H. Reichl,
R. Lempkowski,
G. Sommer,
2003,
2003 IEEE International Symposium on Electromagnetic Compatibility, 2003. EMC '03..
H. Reichl,
W. Mathis,
G. Sommer,
2004,
Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects.