P. Szabo

Short time die attach characterization of semiconductor devices

M. Rencz, P. Szabo, 2007, 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC).

Thermal Measurement and Modeling of Multi-Die Packages

M. Rencz, V. Szekely, Yan Zhang, 2006, IEEE Transactions on Components and Packaging Technologies.

DELPHI Style Compact Modeling of Stacked Die Packages

M. Rencz, V. Szekely, A. Poppe, 2007, Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

Short time die attach characterization of leds for in-line testing application

M. Rencz, A. Poppe, P. Szabo, 2006, 2006 8th Electronics Packaging Technology Conference.

Thermal characterization of multi-die packages

Yan Zhang, A. Poppe, G. Farkas, 2006, 2006 8th Electronics Packaging Technology Conference.

Transient junction-to-case thermal resistance measurement methodology of high accuracy and high repeatability

G. Farkas, P. Szabo, O. Steffens, 2005, IEEE Transactions on Components and Packaging Technologies.