S. Yankee

Discussion Group Summary Wafer Level Reliability (WLR)

C. Messick, S. Yankee, 1997, 1997 IEEE International Integrated Reliability Workshop Final Report (Cat. No.97TH8319).

Investigation of via-dominated multi-modal electromigration failure distributions in dual damascene Cu interconnects with a discussion of the statistical implications

J. Gill, A. von Glasow, S. Yankee, 2002, 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320).