P Damaruganath

Integrated Optical Carrier for Optical/Electrical Interconnect

Lim Teck Guan, Tan Chee Wei, Khoo Yee Mong, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Development of Large Die Fine-Pitch Cu/Low- $k$ FCBGA Package With Through Silicon via (TSV) Interposer

Tai Chong Chai, Shiguo Liu, Yue Ying Ong, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.