Heegon Kim

发表

Modeling and analysis of high-speed through silicon via (TSV) channel and defects

Kwang-Seong Choi, Joungho Kim, Jonghoon J. Kim, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Precise Analytical Model of Power Supply Induced Jitter Transfer Function at Inverter Chains

Jun Fan, Chulsoon Hwang, Heegon Kim, 2018, IEEE Transactions on Electromagnetic Compatibility.

High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs

Joungho Kim, Daniel H. Jung, Heegon Kim, 2016, IEEE Design & Test.

Parallelizing H.264 and AES Collectively

Sung Bum Pan, Yongwha Chung, Heegon Kim, 2013, KSII Trans. Internet Inf. Syst..

A CPU and GPU heterogeneous implementation of matrix multiplication by using OpenCL

Yongwha Chung, Daihee Park, Heegon Kim, 2014 .

A fast and accurate statistical eye-diagram estimation method for high-speed channel including non-linear receiver buffer circuit

Joungho Kim, Yunsaing Kim, Hyunsuk Lee, 2015, 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC).

Design optimization of high bandwidth memory (HBM) interposer considering signal integrity

Joungho Kim, Kyungjun Cho, Yunsaing Kim, 2015, 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).

Overcoming Amdahl's Law by Distributing Workload Asymmetrically

Yongwha Chung, Heegon Kim, Sungju Lee, 2012, ICHIT.

Design of an on-interposer passive equalizer embedded on a ground plane for 30Gbps serial data transmission

Joungho Kim, Jinwook Song, Heegon Kim, 2015, 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).

Design of on-chip linear voltage regulator module and measurement of power distribution network noise fluctuation at high-speed output buffer

Joungho Kim, Jun Fan, Changwook Yoon, 2015, 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS).

TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC

Joungho Kim, Sunkyu Kong, Jonghoon J. Kim, 2015, 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo).

Eye diagram estimation of 8B/10B encoded high-speed serial link for signal integrity test using silicone rubber socket

Joungho Kim, Junyong Park, Jonghoon J. Kim, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

On-chip voltage regulator module (VRM) effect on power/ground noise and jitter at high-speed output buffer

Jun Fan, Heegon Kim, Jingook Kim, 2014, 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Fault detection and isolation of multiple defects in through silicon via (TSV) channel

Kwang-Seong Choi, Joungho Kim, Jonghoon J. Kim, 2014, 2014 International 3D Systems Integration Conference (3DIC).

A Fast and accurate statistical eye-diagram estimation method for high-speed channel including non-linear receiver circuit = 비선형 수신 회로를 포함한 고속 채널에서의 빠르고 정확한 통계 아이다이어그램 예측 기법

김희곤, Heegon Kim, 2015 .

Power-Time Tradeoff of Parallel Execution on Multi-core Platforms

Yongwha Chung, Heegon Kim, Sungju Lee, 2013, MUSIC.

Channel design for wide system bandwidth in a TSV based 3D IC

Joungho Kim, Junho Lee, Heegon Kim, 2011, 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI).

Eye-diagram simulation and analysis of a high-speed TSV-based channel

Jonghoon J. Kim, Daniel H. Jung, Heegon Kim, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

Real-time processing for intelligent-surveillance applications

Yongwha Chung, Heegon Kim, Sungju Lee, 2017, IEICE Electron. Express.

A Wide-band On-chip Passive Equalizer for 30 Gbps Serial Data Transmission

Joungho Kim, Heegon Kim, Jun So Pak, 2012 .

Non-contact wafer-level TSV connectivity test methodology using magnetic coupling

Joungho Kim, Junho Lee, Sunkyu Kong, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

An Efficient High-Speed Channel Modeling Method Based on Optimized Design-of-Experiment (DoE) for Artificial Neural Network Training

Jun Fan, Heegon Kim, Bidyut Sen, 2018, IEEE Transactions on Electromagnetic Compatibility.

Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC

Yong-Ju Kim, Joungho Kim, Kyungjun Cho, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Modeling and Analysis of On-Chip Power Noise Induced by an On-Chip Linear Voltage Regulator Module With a High-Speed Output Buffer

James L. Drewniak, Changwook Yoon, Heegon Kim, 2020, IEEE Transactions on Electromagnetic Compatibility.

Parallel Processing of Multimedia Data in a Heterogeneous Computing Environment

Yongwha Chung, Daihee Park, Heegon Kim, 2014 .

Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling

Junho Lee, Joungho Kim, Jonghoon J. Kim, 2013, 2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo).

Modeling and analysis of open defect in through silicon via (TSV) channel

Kwang-Seong Choi, Joungho Kim, Jonghoon J. Kim, 2013, 2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo).

Signal Integrity of Bump-Less High-Speed through Silicon Via Channel for Terabyte/s Bandwidth 2.5D IC

Yong-Ju Kim, Joungho Kim, Kyungjun Cho, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Secure and Energy-Efficient Video Compression on Multicore-based Handheld Devices

Yongwha Chung, Heegon Kim, Sungju Lee, 2012 .

On-chip linear voltage regulator module (VRM) effect on power distribution network (PDN) noise and jitter at high-speed output buffer

Jun Fan, Joungho Kim, Changwook Yoon, 2015, 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity.

Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling

Junho Lee, Joungho Kim, Sunkyu Kong, 2013, 2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo).

Multicore Processor based Parallel SVM for Video Surveillance System

Daihee Park, Heegon Kim, Sungju Lee, 2011 .

Automatic Identification of a Coughing Animal using Audio and Video Data

Heegon Kim, Hee-Keun Kim, 2016, CloudCom 2016.

Design of an On-Interposer Passive Equalizer for High Bandwidth Memory (HBM) with 30Gbps Data Transmission

Joungho Kim, Heegon Kim, Sumin Choi, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Modeling and Measurement of Ground Bounce Induced by High-Speed Output Buffer With On-Chip Low-Dropout (LDO) Regulator

Jun Fan, Heegon Kim, Jonghyun Cho, 2018, IEEE Transactions on Electromagnetic Compatibility.

Design and Analysis of Power Distribution Network (PDN) for High Bandwidth Memory (HBM) Interposer in 2.5D Terabyte/s Bandwidth Graphics Module

Joungho Kim, Subin Kim, Kyungjun Cho, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

A Novel Stochastic Model-Based Eye-Diagram Estimation Method for 8B/10B and TMDS-Encoded High-Speed Channels

Seongsoo Lee, Joungho Kim, Junyong Park, 2018, IEEE Transactions on Electromagnetic Compatibility.

Interposer Power Distribution Network (PDN) Modeling Using a Segmentation Method for 3-D ICs With TSVs

Junho Lee, Joungho Kim, Heegon Kim, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Worst Case Eye Estimation Method considering Power Noise on Tx Output Driver and Channel Crosstalk & ISI in Interposer-based 2.5D Interfaces

Joungho Kim, Heegon Kim, Jingook Kim, 2014 .

An Efficient Crosstalk-Included Eye-Diagram Estimation Method for High-Speed Interposer Channel on 2.5-D and 3-D IC

Joungho Kim, Daniel H. Jung, Heegon Kim, 2017, IEEE Transactions on Electromagnetic Compatibility.

Machine Learning based Link State Aware Service Function Chaining

Jae-Hyoung Yoo, James Won-Ki Hong, Heegon Kim, 2019, 2019 20th Asia-Pacific Network Operations and Management Symposium (APNOMS).

Energy Efficient Image/Video Data Transmission on Commercial Multi-Core Processors

Yongwha Chung, Daihee Park, Heegon Kim, 2012, Sensors.

Eye-diagram estimation and analysis of High-Bandwidth Memory (HBM) interposer channel with crosstalk reduction schemes on 2.5D and 3D IC

Joungho Kim, Kyungjun Cho, Hyunsuk Lee, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test With Silicone Rubber-Based Sheet Contact

Joungho Kim, Junyong Park, Jonghoon J. Kim, 2017, IEEE Transactions on Electromagnetic Compatibility.

Design and signal integrity analysis of high bandwidth memory (HBM) interposer in 2.5D terabyte/s bandwidth graphics module

Joungho Kim, Kyungjun Cho, Hyunsuk Lee, 2015, 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS).

Power distribution network (PDN) design and analysis of a single and double-sided high bandwidth memory (HBM) interposer for 2.5D Terabtye/s bandwidth system

Joungho Kim, Subin Kim, Kyungjun Cho, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Image Segmentation of Adjoining Pigs Using Spatio-Temporal Information

Yongwha Chung, Sangjin Lee, Daihee Park, 2015 .

Privacy protection of user-created content on multicore-based handheld devices

Yongwha Chung, Heegon Kim, Sungju Lee, 2012, 2012 8th International Conference on Computing Technology and Information Management (NCM and ICNIT).

Estimation and analysis of crosstalk effects in high-bandwidth memory channel

Junyong Park, Dong-Hyun Kim, Joungho Kim, 2018 .

Fault isolation of short defect in through silicon via (TSV) based 3D-IC

Kwang-Seong Choi, Hongseok Kim, Heegon Kim, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module

Joungho Kim, Kyungjun Cho, Hyunsuk Lee, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Coil design for 100 KHz and 6.78 MHz WPT system :Litz and solid wires and winding methods

Jun Fan, Heegon Kim, Jonghyun Cho, 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

A slope and amplitude controllable triangular-current generator for the injection of a broad-band PDN noise

Joungho Kim, Jun Fan, Changwook Yoon, 2016, IEEE Electromagnetic Compatibility Magazine.

A CPU and GPU Heterogeneous Processing of Multimedia Data by using OpenCL

Yongwha Chung, Daihee Park, Heegon Kim, 2015 .

Segmentation of Touching Objects by using Motion Information

Yongwha Chung, Heegon Kim, Jaewon Sa, 2015, ISCC 2015.

Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs

Joungho Kim, Sunkyu Kong, Bumhee Bae, 2014, 2014 International 3D Systems Integration Conference (3DIC).

Frequency and time domain measurement of through-silicon via (TSV) failure

Joungho Kim, Heegon Kim, Jun So Pak, 2012, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.

Design and analysis of silicone rubber-based TERAPOSER for LPDDR4 memory test

Joungho Kim, Jiseong Kim, Junyong Park, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Automated activity monitoring using a visual sensor

Yongwha Chung, Heegon Kim, Sungju Lee, 2012, 2012 6th International Conference on New Trends in Information Science, Service Science and Data Mining (ISSDM2012).

Analytical model for predicting the electromagnetic fields intensity in wireless power transfer systems

Joungho Kim, Jiseong Kim, Chulsoon Hwang, 2011, 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).

Mixed-Mode ABCD Parameters: Theory and Application to Signal Integrity Analysis of PCB-Level Differential Interconnects

Seungyoung Ahn, Jiseong Kim, Joungho Kim, 2011, IEEE Transactions on Electromagnetic Compatibility.

Design of crosstalk compensation passive equalizers for high-speed differential signaling on 2.5D-IC interposer

Junho Lee, Joungho Kim, Sukjin Kim, 2013, 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS).

Measurement-based Signal Quality Test of High-speed TSV Channel

Kwang-Seong Choi, Jonghoon J. Kim, Daniel H. Jung, 2012 .

Impedance of power distribution networks in TSV-based 3D-ICs

Junho Lee, Joungho Kim, Heegon Kim, 2011, 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).

Depth-Based Detection of Standing-Pigs in Moving Noise Environments

Yongwha Chung, Daihee Park, Yeonwoo Chung, 2017, Sensors.

Mobile AP GPU power distribution network simulation and analysis based on chip power model

Joungho Kim, Heegon Kim, Jonghyun Cho, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

A compact on-interposer passive equalizer for chip-to-chip high-speed data transmission

Joungho Kim, Heegon Kim, Sumin Choi, 2012, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.

Design and signal integrity analysis of high bandwidth memory (HBM) interposer in 2.5D terabyte/s bandwidth graphics module

Joungho Kim, Kyungjun Cho, Hyunsuk Lee, 2016 .

Design of on-chip linear voltage regulator module and measurement of power distribution network noise fluctuation at high-speed output buffer

Joungho Kim, Jun Fan, Changwook Yoon, 2015 .

A Wideband On-Interposer Passive Equalizer Design for Chip-to-Chip 30-Gb/s Serial Data Transmission

Junho Lee, Joungho Kim, Heegon Kim, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Embedded toroidal magnetic coupling probe in multi-layer PCBs for current measurement

Jiseong Kim, Joungho Kim, Sunkyu Kong, 2012, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.

Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation

Kwang-Seong Choi, Joungho Kim, Jonghoon J. Kim, 2015, 2015 International 3D Systems Integration Conference (3DIC).

A fast statistical eye-diagram estimation method including internal PDN noise of pseudo-differential receiver buffer

Joungho Kim, Kyungjun Cho, Yunsaing Kim, 2015, 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).

Fast and Precise High-Speed Channel Modeling and Optimization Technique Based on Machine Learning

Jun Fan, Heegon Kim, Bidyut Sen, 2018, IEEE Transactions on Electromagnetic Compatibility.

Design of an On-Silicon-Interposer Passive Equalizer for Next Generation High Bandwidth Memory With Data Rate Up To 8 Gb/s

Minkyu Je, Joungho Kim, Heegon Kim, 2018, IEEE Transactions on Circuits and Systems I: Regular Papers.

Investigation of statistical eye-diagram estimation method for HBM including ISI, X-talk, and power noise

Jun Fan, Heegon Kim, Jonghyun Cho, 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

Eye-diagram estimation using equivalent circuit model of coupled microstrip channel on high-speed and wide I/O Channel for 2.5D and 3D IC

Joungho Kim, Kyungjun Cho, Hyunsuk Lee, 2016, 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI).

Efficient Workload Distribution of Photomosaic Using OpenCL into a Heterogeneous Computing Environment

Yongwha Chung, Daihee Park, Heegon Kim, 2015 .

CPU-GPU hybrid computing for feature extraction from video stream

Yongwha Chung, Daihee Park, Heegon Kim, 2014, IEICE Electron. Express.

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Junho Lee, Joungho Kim, Heegon Kim, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Analysis and optimization of a power distribution network in 2.5D IC with glass interposer

Joungho Kim, Venky Sundaram, Heegon Kim, 2014, 2014 International 3D Systems Integration Conference (3DIC).

Real-Time Pig Segmentation for Individual Pig Monitoring in a Weaning Pig Room

Yongwha Chung, Daihee Park, Hansol Baek, 2016 .

Modeling of power supply induced jitter (PSIJ) transfer function at inverter chains

Jun Fan, Chulsoon Hwang, Heegon Kim, 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

EnsemblePigDet: Ensemble Deep Learning for Accurate Pig Detection

Daihee Park, Heegon Kim, Sungju Lee, 2021, Applied Sciences.

Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface

Joungho Kim, Kyungjun Cho, Jinwook Song, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

Joungho Kim, Chulsoon Hwang, Heegon Kim, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Crosstalk included eye diagram estimation of high-speed and wide I/O interposer channel for 2.5D / 3D IC

Joungho Kim, Daniel H. Jung, Heegon Kim, 2014, 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems.

Signal Integrity Analysis of Silicon/Glass/Organic Interposers for 2.5D/3D Interconnects

Joungho Kim, Daniel H. Jung, Heegon Kim, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Wafer-level TSV connectivity test using ring oscillator scheme

Joungho Kim, Heegon Kim, Jun So Pak, 2012, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.

Cooperative tumour cell membrane targeted phototherapy

Ji-Ho Park, Heegon Kim, Ji-Ho Park, 2017, Nature Communications.

Electrical characteristics analysis and comparison between through silicon via(TSV) and through glass via(TGV)

Joungho Kim, Rao Tummala, Venky Sundaram, 2015, 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).