Sumin Choi

发表

Kwang-Seong Choi, Joungho Kim, Jonghoon J. Kim, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Joungho Kim, Yunsaing Kim, Hyunsuk Lee, 2015, 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC).

Joungho Kim, Kyungjun Cho, Yunsaing Kim, 2015, 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).

Joungho Kim, Jinwook Song, Heegon Kim, 2015, 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).

Joungho Kim, Sunkyu Kong, Jonghoon J. Kim, 2015, 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo).

Jonghoon J. Kim, Daniel H. Jung, Heegon Kim, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

Yong-Ju Kim, Joungho Kim, Kyungjun Cho, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Junho Lee, Joungho Kim, Jonghoon J. Kim, 2013, 2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo).

Yong-Ju Kim, Joungho Kim, Kyungjun Cho, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Joungho Kim, Hyunsuk Lee, Jonghoon J. Kim, 2015, 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo).

Joungho Kim, Heegon Kim, Sumin Choi, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Joungho Kim, Subin Kim, Kyungjun Cho, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Seongsoo Lee, Joungho Kim, Junyong Park, 2018, IEEE Transactions on Electromagnetic Compatibility.

Joungho Kim, Daniel H. Jung, Heegon Kim, 2017, IEEE Transactions on Electromagnetic Compatibility.

Joungho Kim, Kyungjun Cho, Hyunsuk Lee, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Joungho Kim, Dong-Hyun Kim, Junyong Park, 2018, 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC).

Joungho Kim, Junyong Park, Jonghoon J. Kim, 2017, IEEE Transactions on Electromagnetic Compatibility.

Joungho Kim, Kyungjun Cho, Hyunsuk Lee, 2015, 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS).

Joungho Kim, Subin Kim, Kyungjun Cho, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Joungho Kim, Kyungjun Cho, Hyunsuk Lee, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Joungho Kim, Daehwan Lho, Gapyeol Park, 2019, 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).

Joungho Kim, Dong-Hyun Kim, Junyong Park, 2018, 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC).

Joungho Kim, Subin Kim, Kyungjun Cho, 2017, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).

Joungho Kim, Jiseong Kim, Junyong Park, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Joungho Kim, Junyong Park, Shinyoung Park, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Junho Lee, Joungho Kim, Sukjin Kim, 2013, 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS).

Joungho Kim, Heegon Kim, Sumin Choi, 2012, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.

Junho Lee, Joungho Kim, Heegon Kim, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Joungho Kim, Kyungjun Cho, Yunsaing Kim, 2015, 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).

Joungho Kim, Kyungjun Cho, Hyunsuk Lee, 2016, 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI).

Joungho Kim, Kyungjun Cho, Jinwook Song, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Joungho Kim, Kyungjun Cho, Shinyoung Park, 2019, IEEE Transactions on Electromagnetic Compatibility.

Joungho Kim, Daniel H. Jung, Heegon Kim, 2014, 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems.

Joungho Kim, Daniel H. Jung, Heegon Kim, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).