Jaemin Lim

发表

Modeling and analysis of high-speed through silicon via (TSV) channel and defects

Kwang-Seong Choi, Joungho Kim, Jonghoon J. Kim, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Design optimization of high bandwidth memory (HBM) interposer considering signal integrity

Joungho Kim, Kyungjun Cho, Yunsaing Kim, 2015, 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).

Through-Silicon Via Capacitance–Voltage Hysteresis Modeling for 2.5-D and 3-D IC

Joungho Kim, Antonio Orlandi, Dong-Hyun Kim, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Integration validation of key components for small sounding rockets

Jaemin Lim, Yongtae Yun, Jeongmoo Huh, 2020 .

TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC

Joungho Kim, Sunkyu Kong, Jonghoon J. Kim, 2015, 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo).

Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC

Yong-Ju Kim, Joungho Kim, Kyungjun Cho, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Signal Integrity of Bump-Less High-Speed through Silicon Via Channel for Terabyte/s Bandwidth 2.5D IC

Yong-Ju Kim, Joungho Kim, Kyungjun Cho, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC

Joungho Kim, Hyunsuk Lee, Jonghoon J. Kim, 2015, 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo).

ViewMap: Sharing Private In-Vehicle Dashcam Videos

Younghoon Kim, Minho Kim, Jaemin Lim, 2017, NSDI.

An Efficient Crosstalk-Included Eye-Diagram Estimation Method for High-Speed Interposer Channel on 2.5-D and 3-D IC

Joungho Kim, Daniel H. Jung, Heegon Kim, 2017, IEEE Transactions on Electromagnetic Compatibility.

Pinto: Enabling Video Privacy for Commodity IoT Cameras

Jaemin Lim, Suk-Bok Lee, Kiyeon Kim, 2018, CCS.

Eye-diagram estimation and analysis of High-Bandwidth Memory (HBM) interposer channel with crosstalk reduction schemes on 2.5D and 3D IC

Joungho Kim, Kyungjun Cho, Hyunsuk Lee, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test With Silicone Rubber-Based Sheet Contact

Joungho Kim, Junyong Park, Jonghoon J. Kim, 2017, IEEE Transactions on Electromagnetic Compatibility.

Design and signal integrity analysis of high bandwidth memory (HBM) interposer in 2.5D terabyte/s bandwidth graphics module

Joungho Kim, Kyungjun Cho, Hyunsuk Lee, 2015, 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS).

Estimation and analysis of crosstalk effects in high-bandwidth memory channel

Junyong Park, Dong-Hyun Kim, Joungho Kim, 2018 .

Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module

Joungho Kim, Kyungjun Cho, Hyunsuk Lee, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Preserving Location Privacy of Connected Vehicles With Highly Accurate Location Updates

Minho Kim, Jaemin Lim, Suk-Bok Lee, 2017, IEEE Communications Letters.

Design and signal integrity analysis of high bandwidth memory (HBM) interposer in 2.5D terabyte/s bandwidth graphics module

Joungho Kim, Kyungjun Cho, Hyunsuk Lee, 2016 .

Making Connected Cars Untraceable via DSRC Radios

Jaemin Lim, Suk-Bok Lee, Hyunwoo Yu, 2020, IEEE Access.

Eye-diagram estimation using equivalent circuit model of coupled microstrip channel on high-speed and wide I/O Channel for 2.5D and 3D IC

Joungho Kim, Kyungjun Cho, Hyunsuk Lee, 2016, 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI).

Crosstalk included eye diagram estimation of high-speed and wide I/O interposer channel for 2.5D / 3D IC

Joungho Kim, Daniel H. Jung, Heegon Kim, 2014, 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems.