Qianwen Chen

Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio TSVs applications

Mitsu Koyanagi, Takafumi Fukushima, Yangyang Yan, 2015, 2015 International 3D Systems Integration Conference (3DIC).

A new method to evaluate a corresponding colors dataset based on its two derived transforms

Haifeng Wang, Qianwen Chen, Shengyan Cai, 2017 .

Fabrication and electrical characteristics of a novel interposer with polymer liner and silicon pillars with ultra-low-resistivity as through-silicon-vias (TSVs) for 2.5D/3D applications

Yingtao Ding, Yangyang Yan, Qianwen Chen, 2015 .

Thick benzocyclobutene etching using high density SF6/O2 plasmas

Jian-Qiang Lu, Dingyou Zhang, Qianwen Chen, 2011 .

Investigation on mechanism of polymer filling in high-aspect-ratio trenches for through-silicon-via (TSV) application

Yingtao Ding, Yangyang Yan, Qianwen Chen, 2014 .