J. Malmodin

发表

Life cycle assessment of third generation (3G) wireless telecommunication systems at Ericsson

J. Malmodin, L. Oliv, P. Bergmark, 2001, Proceedings Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing.

LCA of data transmission and IP core networks

J. Malmodin, M. Nilsson, D. Lunden, 2012, 2012 Electronics Goes Green 2012+.

A reliable and environmentally friendly packaging technology-flip-chip joining using anisotropically conductive adhesive

Johan Liu, J. Malmodin, Z. Lai, 1999 .

A reliable and environmentally friendly packaging technology-flip chip joining using anisotropically conductive adhesive

J. Malmodin, Z. Lai, J. Liu, 1998, Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180).