Speed it up to 10 Gb/s and flip chip it: VCSEL today

Accumulation of all advantageous properties VCSELs are famous for, like low power consumption, circular low divergent beam profile, high modulation bandwidth, and scalability of monolithic arrangements, results in two-dimensional (2D) VCSEL arrays that appear as key components to reach highest aggregate bandwidths of tomorrow's parallel optical transceivers. We report on 2D VCSEL arrays, substrate emitting although operating at 850 nm and prepared for flip-chip bonding, that are well suited for the customer's needs in terms of speed, power consumption, reliability and compact integration. Based on advanced technology, our arrays target the requirements of transceivers in the OC-192 VSR and 10 Gigabit Ethernet arena. In this paper we present the basic technology, static and dynamic device characteristics as well as reliability data for a 4x12 850 nm bottom-emitting VCSEL array. A13

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