论文信息 - 300 mm InGaAs-on-insulator substrates fabricated using direct wafer bonding and the Smart Cut™ technology - 字舞流文

300 mm InGaAs-on-insulator substrates fabricated using direct wafer bonding and the Smart Cut™ technology

H. Grampeix | S. Sollier | J. Widiez | Mickael Martin | T. Baron | R. Alcotte | F. Mazen | A. Salaun | J. Moulet | S. Favier | G. Gaudin | C. Veytizou | F. Madeira | E. Beche