Automated optical inspection of liquid crystal display anisotropic conductive film bonding
暂无分享,去创建一个
Xiaohui Du | Lin Liu | Yong Liu | Jing Zhang | Juanxiu Liu | Guangming Ni | X. Du | Lin Liu | Juanxiu Liu | Yong Liu | Guangming Ni | Jing Zhang
[1] B. Tao,et al. Simulation for the contact resistance of a single anisotropic conductive adhesive particle with rough surface , 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
[2] Jong-Woong Kim,et al. Effects of bonding pressure on the thermo-mechanical reliability of ACF interconnection , 2006 .
[3] Xinjun Sheng,et al. ACF-COG interconnection conductivity inspection system using conductive area , 2013, Microelectron. Reliab..
[4] Xu Chen,et al. Mechanical properties of anisotropic conductive film with strain rate and temperature , 2009 .
[5] Investigation of bulk resistance for metal-coated polymer particles used in anisotropic conductive adhesive , 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
[6] Yong Liu,et al. Automatic identification of fungi under complex microscopic fecal images , 2015, Journal of biomedical optics.
[7] Myung Jin Yim,et al. Anisotropic conductive films (ACFs) for ultra-fine pitch chip-on-glass (COG) applications , 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..
[8] B. Tao,et al. Bulk Resistance Evaluation of Anisotropic Conductive Adhesive Particles Considering the Current Bending Effect , 2012 .
[9] K. Paik,et al. Effects of ACF Bonding Parameters on ACF Joint Characteristics for High-Speed Bonding Using Ultrasonic Bonding Method , 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[10] Chris Bailey,et al. Computational modelling of the anisotropic conductive adhesive assembly process , 2001, Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506).
[11] J. Rasul,et al. Flip chip on paper assembly utilizing anisotropic conductive adhesive , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
[12] Xu Chen,et al. Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection , 2006, Microelectron. Reliab..
[13] J. Zhong,et al. A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applications , 2008 .
[14] Xinjun Sheng,et al. An Automatic Bump Detecting System for LCD COG Module Using Fuzzy Reasoning , 2012 .
[15] Yu Xie,et al. Automatic Identification of Human Erythrocytes in Microscopic Fecal Specimens , 2015, Journal of Medical Systems.
[16] Y. C. Chan,et al. Electrical Conductive Characteristics of Anisotropic Conductive Adhesive Particles , 2003 .
[17] L. Kogut,et al. Electrical Contact Resistance Theory for Anisotropic Conductive Films Considering Electron Tunneling and Particle Flattening , 2007, IEEE Transactions on Components and Packaging Technologies.
[18] Xinjun Sheng,et al. Particle on Bump (POB) Technique for Ultra-Fine Pitch Chip on Glass (COG) Applications , 2007, 2007 8th International Conference on Electronic Packaging Technology.