Millimeter-wave Transceiver MCM Usig Multi-layer BCB with Integrated Planner Antenna

A novel millimeter-wave transceiver MCM using multi-layer BCB was proposed. This MCM is based on a glass substrate laminated with three layers of BCB thin film, enabling four-layer 3-D circuitry. We report two different Ka-band MCMs of this structure; namely, a flip-chip assembled 28 GHz transceiver MCM integrating four MMICs of independent functions, and a 38 GHz receiver MCM with built-in four-element slot antenna array and flip-chip assembled MMIC.

[1]  S. Fujita,et al.  K-band receiver front-end IC integrating micromachined filter and flip-chip assembled active devices , 1999, 1999 IEEE MTT-S International Microwave Symposium Digest (Cat. No.99CH36282).

[2]  Minh Le,et al.  High performance, high yield millimeter-wave MMIC LNAs using InP HEMTs , 1996, 1996 IEEE MTT-S International Microwave Symposium Digest.

[3]  Morikazu Sagawa,et al.  An advanced millimeter-wave flip-chip IC integrating different kinds of active devices , 1996, 1996 IEEE MTT-S International Microwave Symposium Digest.

[4]  M. Sagawa,et al.  A millimeter-wave flip-chip IC using micro-bump bonding technology , 1996, 1996 IEEE International Solid-State Circuits Conference. Digest of TEchnical Papers, ISSCC.