论文信息 - Assessment of Need for Solder in Modeling Potted Electronics During Gun-Shot - 字舞流文

Assessment of Need for Solder in Modeling Potted Electronics During Gun-Shot

J. A. Cordes | J. Cordes | L. E. Reinhardt | Aisha Haynes | J. D. Metz | A. Haynes | L. Reinhardt | J. Metz

[1] N. Kelkar,et al. Solder joint reliability model vath modified Darveaux's equations for the micro smd wafer level-chip scale package family , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[2] B. Z. Hong,et al. Modeling thermally induced viscoplastic deformation and low cycle fatigue of CBGA solder joints in a surface mount package , 1996 .

[3] Nien-Hua Chao,et al. The Use of Potting Materials for Electronic-Packaging Survivability in Smart Munitions , 2011 .

[4] Hua Lu,et al. Solder life prediction in a thermal analysis software environment , 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

[5] P. Lall,et al. Solder Joint Reliability in Electronics Under Shock and Vibration Using Explicit Finite-Element Submodeling , 2006, IEEE Transactions on Electronics Packaging Manufacturing.

[6] J. A. Cordes,et al. Thermomechanical Impact of Polyurethane Potting on Gun Launched Electronics , 2013 .

[7] Xuejun Fan,et al. Effect of finite element modeling techniques on solder joint fatigue life prediction of flip-chip BGA packages , 2006, 56th Electronic Components and Technology Conference 2006.

[8] X. Chen,et al. Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling , 2005, Microelectron. Reliab..