论文信息 - An E-band transmitter module constructed with four WLCSP MMICs solder-reflowed On PCB

An E-band transmitter module constructed with four WLCSP MMICs solder-reflowed On PCB

The first edition of E-band transmitter module is demonstrated. This module is consisted of four WLCSP MMICs solder-reflowed on a designated PCB 14 mm × 10 mm in size. Because the WLCSP technology is incorporated, the module is mass producible and potentially very low cost compared with the current E-band products. The treatment of WLCSP MMIC in the E-band should be carefully done so as to suppress undesired bulk mode, an electro-magnetic absorber stables the performance. To demonstrate a TX module, we newly designed an LNA as driver amplifier and a PA, which are cascade combined with tripler and up-converter WLCSP MMICs on PCB. The LNA and PA have variable gain function modified of topology from the dual-HEMT amplifier. The conversion gain of TX module is 19dB and the saturated RF output power level is 17.5dBm.

K. Tsukashima | M. Kubota | A. Yonamine | T. Tokumitsu | Y. Hasegawa

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