A THERMAL EVALUATION OF INTEGRATED CIRCUITS : ON CHIP OFFSET TEMPERATURE MEASUREMENT AND MODELING

This paper presents a chip and test configuration for thermal evaluation based on MOSIS 0.5μ technology. We measured spatial temperature differences as high as 20.65 °C on a 2mm by 2mm Tiny Chip. Our research shows that circuit location on a chip determines its default offset temperature and heat transport properties, which must be considered for prediction of junction temperature and electro-thermal analysis. A model has been developed to verify measurement results. The results yield insight about on-chip heat dissipation, which is very useful for mixed-signal VLSI designs and circuit reliability analysis.

[1]  H. Mantooth,et al.  Modeling and Simulation of Electrical and Thermal Interaction , 1995 .

[2]  Mark Horowitz,et al.  Energy dissipation in general purpose microprocessors , 1996, IEEE J. Solid State Circuits.

[3]  H. Vinke,et al.  A novel approach for the thermal characterization of electronic parts , 1995, Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

[4]  H. Shaukatullah.  A method of using thermal test chips with diodes for thermal characterization of electronic packages without calibration , 1995, Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

[5]  Dake Liu,et al.  Power consumption estimation in CMOS VLSI chips , 1994, IEEE J. Solid State Circuits.

[6]  J. W. Sofia.  Analysis of thermal transient data with synthesized dynamic models for semiconductor devices , 1994 .

[7]  R. Bouchakour,et al.  Modeling of Power Mosfet and Bipolar Transistors Taking into Account the Thermoelectrical Interactions , 1995 .

[8]  A. Claassen,et al.  Comparison of diodes and resistors for measuring chip temperature during thermal characterization of electronic packages using thermal test chips , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[9]  R. P. Tye,et al.  Determination of appropriate thermal transport properties for electronics applications , 1992, [1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

[10]  H. Vinke,et al.  Recent achievements in the thermal characterization of electronic devices by means of boundary condition independent compact models , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.