Flip-chip packaging using micromachined conductive polymer bumps and alignment pedestals for MOEMS

Using flip-chip bonding techniques with micromachined conductive polymer bumps and passive alignment techniques with electroplated side alignment pedestal bumps, a prototype microoptoelectromechanical systems (MOEMS) structure for optical input/output (I/O) couplers has been designed, fabricated and characterized. A top MOEMS substrate has through holes, contact metal pads, and side alignment pedestals with electroplated NiFe to align GaAs metal-semiconductor-metals (MSMs). Conductive polymer bumps have been formed on contact metal pads of GaAs MSMs using thick photoresist bump-holes as molding patterns. A diced GaAs photodetectors die with micromachined conductive polymer bumps was aligned to the side alignment pedestals and flip-chip bonded onto the substrate. This conductive polymer flip-chip bonding technique allowed a very low contact resistance (/spl sim/10 m/spl Omega/), a lower bonding temperature (/spl sim/170/spl deg/C), and simple processing steps. The GaAs MSM photodetectors flip-chip mounted on the top of OE-MCM substrate showed a low dark current of about 10 nA and a high responsivity of 0.33 A/W.

[1]  Rainee N. Simons,et al.  Optical Control of Microwave Devices , 1990 .

[2]  Hadis Morkoç,et al.  Recent developments in ohmic contacts for III-V compound semiconductors , 1992 .

[3]  Lawrence Anthony Hornak,et al.  Co-integration of optoelectronics and submicrometer CMOS , 1993 .

[4]  Li Li,et al.  Reliability and failure mechanism of isotropically conductive adhesives joints , 1995, 1995 Proceedings. 45th Electronic Components and Technology Conference.

[5]  D. Ferling,et al.  Silicon motherboards for multichannel optical modules , 1995 .

[6]  M. Honsberg,et al.  Self-aligned packing of an optical switch array with integrated tapers , 1995, IEEE Photonics Technology Letters.

[7]  P. Vettiger,et al.  Passive self-aligned low-cost packaging of semiconductor laser arrays on Si motherboard , 1995, IEEE Photonics Technology Letters.

[8]  H. Takahara,et al.  New optical and electrical hybrid packaging techniques using optical waveguides for optoelectronic multichip modules , 1996 .

[9]  Toshikazu Hashimoto,et al.  A 10 Gb/s hybrid-integrated receiver array module using a planar lightwave circuit (PLC) platform including a novel assembly region structure , 1996 .

[10]  Seungug Koh,et al.  Novel integrated optical I/O couplers on MCMs using MEMS techniques , 1996, Photonics West.

[11]  S. Purushothaman,et al.  Development of high conductivity lead (Pb)-free conducting adhesives , 1996 .

[12]  G. Nakagawa,et al.  Lens-coupled laser diode module integrated on silicon platform , 1996 .

[13]  B. Robertson,et al.  On-die diffractive alignment structures for packaging of microlens arrays with 2-D optoelectronic device arrays , 1996, IEEE Photonics Technology Letters.

[14]  Silicon waferboard-based single-mode optical fiber interconnects , 1996 .

[15]  John A. Neff,et al.  Tolerance analysis for three-dimensional optoelectronic systems packaging , 1996 .

[16]  J. Kimura,et al.  A new anisotropic conductive film with arrayed conductive particles , 1996 .

[17]  R. H. Estes.  Flip-chip packaging with polymer bumps , 1997 .

[18]  C. Ahn,et al.  Optical reflectivity of micromachined {111}-oriented silicon mirrors for optical input - output couplers , 1997 .

[19]  Shinji Takeda,et al.  A novel die bonding adhesive-silver filled film , 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.