Metal electromigration induced by solder flux residue in hybrid microcircuits

Electrical failure due to excessive current-leakage was observed in a hybrid following burn-in. The current leakage was a result of extensive metal electromigration between substrate conductors, which has been correlated with flux residue in the device. It has been determined that water and other species are produced by thermal degradation of the flux during burn-in at 125 degrees C. Failure analysis results, along with associated materials and electronic testing, are reported.<<ETX>>

[1]  L. Psota-Kelty,et al.  Chromatographic studies to evaluate circuit board cleanliness , 1988, 38th Electronics Components Conference 1988., Proceedings..

[2]  S. J. Krumbein,et al.  Metallic electromigration phenomena , 1988 .

[3]  F. Juskey,et al.  Controlled Electromigration for Field Failure Acceleration , 1987 .

[4]  P. Wynblatt,et al.  Water Adsorption and Surface Conductivity Measurements on alpha -Alumina Substrates , 1987 .

[5]  R. Benson,et al.  Current-Leakage Failures in Hybrid Microcircuits , 1986 .

[6]  R. M. Swanson,et al.  Observation of rapid field aided diffusion of silver in metal‐oxide‐semiconductor structures , 1983 .

[7]  W. Swartz,et al.  The Adsorption of Water on Mietallic Packages , 1983, 21st International Reliability Physics Symposium.

[8]  G. Digiacomo.  Metal Migration (Ag, Cu, Pb) in Encapsulated Modules and Time-to-Fail Model as a Function of the Environment and Package Properties , 1982, 20th International Reliability Physics Symposium.

[9]  M. V. Coleman,et al.  Silver migration in thick film conductors and chip attachment resins , 1981 .

[10]  R. Chaffin.  Migration of Silver from Silver-Loaded Polyimide Adhesive Chip Bonds at High Temperatures , 1981 .

[11]  Aaron Der Marderosian,et al.  Humidity Threshold Variations for Dendrite Growth on Hybrid Substrates , 1977, 15th International Reliability Physics Symposium.

[12]  J. J. Licari,et al.  Design guidelines for hybrid microcircuits; organic adhesives for hybrid microcircuits , 1975 .

[13]  Gábor Harsányi,et al.  ELECTROCHEMICAL MIGRATION IN THICK-FILM IC-S , 1985 .

[14]  N. Delollis.  Aging characteristics of electrically conductive adhesives , 1976 .

[15]  T. W. Griswold,et al.  Migratory Gold Resistive Shorts: Chemical Aspects of a Failure Mechanism , 1975, 13th International Reliability Physics Symposium.

[16]  Alex Shumka,et al.  Migrated-Gold Resistive Shorts in Microcircuits , 1975, 13th International Reliability Physics Symposium.