Digitally programmable SRAM timing for nano-scale technologies

Embedded memory is a critical component of modern SOCs. In highly scaled CMOS, process variability and device aging degradation cause a significant increase in the soft failure rate of embedded SRAMs. As process technology continues to scale, these issues become more pronounced, especially when the device is operating at its minimum operating voltage, VDD MIN. This failure rate can even exceed the maximum repair capacity of the SRAM resulting in yield loss. Guard bands in signal timing can be introduced to mitigate this loss, however it comes at the cost of excessive power dissipation and read access time. Digitally programmable timing allows for a code based, post-fabrication optimization approach to reduce the soft failure rate, and in turn maximize yield, while minimizing excessive power dissipation and read access time. Additionally, the digital code can be re-calibrated over time to compensate for continued device parameter drift due to aging degradation.

[1]  D. Ielmini,et al.  A New NBTI Model Based on Hole Trapping and Structural Relaxation in MOS Dielectrics , 2009, IEEE Transactions on Electron Devices.

[2]  Hamid Mahmoodi,et al.  Analysis of SRAM Reliability under Combined Effect of NBTI, Process and Temperature Variations in Nano-Scale CMOS , 2010, 2010 5th International Conference on Future Information Technology.

[3]  R. Heald,et al.  Variability in sub-100nm SRAM designs , 2004, ICCAD 2004.

[4]  R. Degraeve,et al.  Review of reliability issues in high-k/metal gate stacks , 2008, 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits.

[5]  M. Maymandi-Nejad,et al.  A monotonic digitally controlled delay element , 2005, IEEE Journal of Solid-State Circuits.

[6]  Shi-Yu Huang,et al.  Robust SRAM Design via BIST-Assisted Timing-Tracking (BATT) , 2009, IEEE Journal of Solid-State Circuits.

[7]  T. Grasser,et al.  Evidence That Two Tightly Coupled Mechanisms Are Responsible for Negative Bias Temperature Instability in Oxynitride MOSFETs , 2009, IEEE Transactions on Electron Devices.

[8]  Ping Wang,et al.  Variability in sub-100nm SRAM designs , 2004, IEEE/ACM International Conference on Computer Aided Design, 2004. ICCAD-2004..

[9]  J. Povazanec,et al.  Integration of SRAM redundancy into production test , 2002, Proceedings. International Test Conference.

[10]  M.J.M. Pelgrom,et al.  Matching properties of MOS transistors , 1989 .

[11]  Bharadwaj Amrutur,et al.  A replica technique for wordline and sense control in low-power SRAM's , 1998, IEEE J. Solid State Circuits.

[12]  D. Burnett,et al.  Implications of fundamental threshold voltage variations for high-density SRAM and logic circuits , 1994, Proceedings of 1994 VLSI Technology Symposium.

[13]  Manoj Sachdev,et al.  Design challenges in nanometric embedded memories , 2009, 2009 3rd International Conference on Signals, Circuits and Systems (SCS).

[14]  Mohab Anis,et al.  Reducing SRAM Power Using Fine-Grained Wordline Pulsewidth Control , 2010, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

[15]  John Keane,et al.  An All-In-One Silicon Odometer for Separately Monitoring HCI, BTI, and TDDB , 2010, IEEE Journal of Solid-State Circuits.

[16]  Michael Ouellette,et al.  BIST controlled variable sense amp timing for 90nm embedded SRAM , 2004, Proceedings of the IEEE 2004 Custom Integrated Circuits Conference (IEEE Cat. No.04CH37571).

[17]  Hao-I Yang,et al.  Timing control degradation and NBTI/PBTI tolerant design for Write-replica circuit in nanoscale CMOS SRAM , 2009, 2009 International Symposium on VLSI Design, Automation and Test.