Quasi-static PEEC planar solver using a weighted combination of 2D and 3D analytical Green's functions and a predictive meshing generator
暂无分享,去创建一个
Francisco V. Fernández | Elisenda Roca | Neus Vidal | Javier J. Sieiro | José María López-Villegas | Saiyd Ahyoune | Tomás Carrasco Carrillo | J. López-Villegas | F. Fernández | N. Vidal | J. Sieiro | S. Ahyoune | E. Roca
[1] J. Ekman,et al. Impact of partial element accuracy on PEEC model stability , 2006, IEEE Transactions on Electromagnetic Compatibility.
[2] C. Hoer,et al. Exact inductance equations for rectangular conductors with applications to more complicated geometries , 1965 .
[3] Saiyd Ahyoune,et al. 1D/2D hybrid mesh PEEC solver for the analysis of multilayer planar circuits , 2017, 2017 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization for RF, Microwave, and Terahertz Applications (NEMO).
[4] Hai Lan,et al. Accurate closed-form expressions for the frequency-dependent line parameters of on-chip interconnects on lossy silicon substrate , 2001, 2001 IEEE MTT-S International Microwave Sympsoium Digest (Cat. No.01CH37157).
[5] A. Niknejad,et al. Analysis of eddy-current losses over conductive substrates with applications to monolithic inductors and transformers , 2001 .
[6] A. Orlandi,et al. Internal impedance of conductors of rectangular cross section , 1999 .
[7] Francisco V. Fernández,et al. Extending the frequency range of quasi-static electromagnetic solvers , 2017, 2017 14th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD).
[8] A.C. Cangellaris,et al. Investigation on the Frequency Range of Validity of Electroquasistatic RC Models for Semiconductor Substrate Coupling Modeling , 2007, IEEE Transactions on Electromagnetic Compatibility.
[9] A. Ruehli. Equivalent Circuit Models for Three-Dimensional Multiconductor Systems , 1974 .
[10] S. Ahyoune. Heterogeneous Integration of RF and Microwave Systems Using Multi-layer Low-Temperature Co-fired Ceramics Technology , 2017 .
[11] Kaustav Banerjee,et al. Fast High-Frequency Impedance Extraction of Horizontal Interconnects and Inductors in 3-D ICs With Multiple Substrates , 2012, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.
[12] Jun Imaoka,et al. Evaluation of the Lagrangian Method for Deriving Equivalent Circuits of Integrated Magnetic Components: A Case Study Using the Integrated Winding Coupled Inductor , 2015 .
[13] J. Sieiro,et al. Ab initio adaptive meshing for planar passive component modeling , 2012, 2012 42nd European Microwave Conference.
[14] Danesh Daroui,et al. PERFORMANCE ANALYSIS OF PARALLEL NON- ORTHOGONAL PEEC-BASED SOLVER FOR EMC APPLICATIONS , 2012 .
[15] Veysel Demir,et al. Microstrip conductor loss models for electromagnetic analysis , 2003 .
[16] Lijun Jiang,et al. Skin-Effect Loss Models for Time- and Frequency-Domain PEEC Solver , 2013, Proceedings of the IEEE.
[17] Peter Scholz. Analysis and Numerical Modeling of Inductively Coupled Antenna Systems , 2010 .