Numerical simulation of phase change heat transfer in PCM-encapsulated heat sinks

The enthalpy-based computational model is developed for analysing PCM-encapsulated heat sinks for electronics chips. Solution is obtained by developing a control volume-based finite difference code and results are validated by comparing results with that given by analytical solution available for a limiting case problem. Preliminary results based on a parametric study indicate the two-dimensional code developed for this study can be used in evaluating PCM, and selecting geometrical dimensions of the PCM encapsulated heat sink.