Modeling and Parameter Extraction of Bond-Wires in Internally Matched RF Power Transistor

Metal wire bonding interconnection is the key means in the internal matching technology of RF power transistor.The diameter,length,arch height and space of bond-wires have great impacts on the radio frequency performance of RF power transistor.The three-dimensional electromagnetic simulation software EMDS and RF circuit design software ADS are used to model and extract the radio frequency equivalent parameters of the bond-wire. Then,the relationship between the variation of physical parameters and the radio frequency equivalent parameters of bond-wires are studied.Finally,the corresponding optimal design measures are proposed for the selection of bond-wires in the internal matching technology of RF power transistor.