Singulation for imaging ring arrays of capacitive micromachined ultrasonic transducers
暂无分享,去创建一个
A. F. Sarioglu | Chienliu Chang | Azadeh Moini | Amin Nikoozadeh | Xuefeng Zhuang | Ali Fatih Sarioglu | Nikhil Apte | Butrus T Khuri-Yakub | A. Moini | Chienliu Chang | A. Nikoozadeh | B. Khuri-Yakub | X. Zhuang | N. Apte
[1] Michaël Gauthier,et al. A mechanical de-tethering technique for silicon MEMS etched with a DRIE process , 2009 .
[2] Roger T. Howe,et al. A dry wafer-reconstitution process with zero insertion force by embedded alignment guide tabs , 2012 .
[3] Thomas L. Szabo,et al. Diagnostic Ultrasound Imaging: Inside Out , 2004 .
[4] Omer Oralkan,et al. Capacitive micromachined ultrasonic transducers for medical imaging and therapy , 2011, Journal of micromechanics and microengineering : structures, devices, and systems.
[5] O. Oralkan,et al. Capacitive micromachined ultrasonic transducers: fabrication technology , 2005, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.
[6] Chao Wang,et al. Analytical characterization using surface-enhanced Raman scattering (SERS) and microfluidic sampling , 2015, Nanotechnology.
[7] Thomas A. Berfield,et al. Die separation and rupture strength for deep reactive ion etched silicon wafers , 2013 .
[8] M. Legros,et al. Piezocomposite and CMUT arrays assessment through in vitro imaging performances , 2008, 2008 IEEE Ultrasonics Symposium.
[9] O. Oralkan,et al. Forward-viewing CMUT arrays for medical imaging , 2004, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.
[10] Liu Haobing,et al. Layout controlled one-step dry etch and release of MEMS using deep RIE on SOI wafer , 2006, Journal of Microelectromechanical Systems.
[11] Yung-Cheng Lee,et al. Tether- and post-enabled flip-chip assembly for manufacturable RF-MEMS , 2004 .
[12] Martin O. Culjat,et al. Transurethral ultrasound catheter-based transducer with flexible polyimide joints , 2009, 2009 IEEE International Ultrasonics Symposium.
[13] O. Ehrmann,et al. Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays , 2013, IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control.
[14] M. Kumagai,et al. Advanced dicing technology for semiconductor wafer -Stealth Dicing , 2006, 2006 IEEE International Symposium on Semiconductor Manufacturing.
[15] Yonghao Cui,et al. De-tethering of high aspect ratio metallic and polymeric MEMS/NEMS parts for the direct pick-and-place assembly of 3D microsystem , 2008 .
[16] Miko Elwenspoek,et al. Guidelines for etching silicon MEMS structures using fluorine high-density plasmas at cryogenic temperatures , 2002 .
[17] A. S. Savoia,et al. A CMUT probe for medical ultrasonography: from microfabrication to system integration , 2012, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.
[18] O. Oralkan,et al. Integration of 2D CMUT arrays with front-end electronics for volumetric ultrasound imaging , 2008, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.
[19] O. Oralkan,et al. Volumetric ultrasound imaging using 2-D CMUT arrays , 2003, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.
[20] Chi Hyung Seo,et al. Forward-looking intracardiac imaging catheters using fully integrated CMUT arrays , 2010, 2010 IEEE International Ultrasonics Symposium.
[21] O. Oralkan,et al. Next-gen ultrasound , 2009, IEEE Spectrum.
[22] Chienliu Chang,et al. A 32×32 integrated CMUT array for volumetric ultrasound imaging , 2013, 2013 IEEE International Ultrasonics Symposium (IUS).
[23] Chienliu Chang,et al. An integrated Ring CMUT array for endoscopic ultrasound and photoacoustic imaging , 2013, 2013 IEEE International Ultrasonics Symposium (IUS).
[24] Chih-Kung Lee,et al. Etching submicrometer trenches by using the Bosch process and its application to the fabrication of antireflection structures , 2005 .
[25] Hien Nguyen,et al. Multifunctional catheters combining intracardiac ultrasound imaging and electrophysiology sensing , 2008, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.
[26] Mitsuhiro Shikida,et al. Effect of temperature on fracture toughness in a single-crystal-silicon film and transition in its fracture mode , 2007 .
[27] Butrus T. Khuri-Yakub,et al. Minimally Redundant 2-D Array Designs for 3-D Medical Ultrasound Imaging , 2009, IEEE Transactions on Medical Imaging.
[28] Karen Willcox,et al. Kinetics and kinematics for translational motions in microgravity during parabolic flight. , 2009, Aviation, space, and environmental medicine.