A study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow

This paper describes a comprehensive numerical study of the effects of many parameters on the propagation of delaminations in the die-attach layer using a finite element linear elastic fracture mechanics approach. The parameters investigated include the coefficient of thermal expansion (CTE) of the die-attach material, the thickness of the die-attach layer, the CTE of the pad material and the location and size of the initial delaminations (defects). The effect of the pressure of water vapor at the delamination was also investigated.

[1]  M. Kanninen,et al.  A finite element calculation of stress intensity factors by a modified crack closure integral , 1977 .

[2]  A. Bar-Cohen,et al.  A shear based optimization of adhesive thickness for die bonding , 1994, Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM).

[3]  K. Sawada,et al.  Package Deformation And Cracking Mechanism Due To Reflow Soldering , 1993, Proceedings of Japan International Electronic Manufacturing Technology Symposium.

[4]  Andrew A. O. Tay,et al.  Moisture-induced interfacial delamination growth in plastic IC packages during solder reflow , 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

[5]  Sheng Liu,et al.  Behavior of delaminated plastic IC packages subjected to encapsulation cooling, moisture absorption, and wave soldering , 1995 .

[6]  Z. Suo,et al.  Mixed mode cracking in layered materials , 1991 .

[7]  A. Bar-Cohen,et al.  Mechanistic figures of merit for die-attach materials , 1996, InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V.

[8]  A.A.O. Tay,et al.  Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering , 1997, Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307).

[9]  David B. Bogy,et al.  Edge-Bonded Dissimilar Orthogonal Elastic Wedges Under Normal and Shear Loading , 1968 .

[10]  Tingyu Lin,et al.  Moisture diffusion and heat transfer in plastic IC packages , 1996 .

[11]  A. Nishimura,et al.  Measurement of IC Molding Compound Adhesion Strength and Prediction of Interface Delamination Within Package. , 1994 .

[12]  J. Dundurs Discussion: ``Edge-Bonded Dissimilar Orthogonal Elastic Wedges Under Normal and Shear Loading'' (Bogy, D. B., 1968, ASME J. Appl. Mech., 35, pp. 460-466) , 1969 .

[13]  T. Lim,et al.  The impact of die attach material on type II popcorn cracking , 1998, Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235).

[14]  I. Raju Calculation of strain-energy release rates with higher order and singular finite elements , 1987 .

[15]  Andrew A. O. Tay,et al.  Predicting delamination in plastic IC packages and determining suitable mold compound properties , 1994 .

[16]  Andrew A. O. Tay,et al.  Effects of moisture and delamination on cracking of plastic IC packages during solder reflow , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.