Advanced thermal tester for accurate measurement of internal thermal resistance of high power electronic modules

A thermal tester has been developed for the accurate measurement of the internal thermal resistance of high-power electronic modules. The tester is designed for the simultaneous measurement of 20 electronic modules each dissipating in excess of 200 W. The heat dissipated is transmitted to the ambient by water-cooled cold plates dedicated to each test site. The tester system layout, mounting assembly, hydraulic design, cold-plate spreader design and data acquisition instrumentation are described. Sample measurements and the associated uncertainty are also discussed. The sample results are validated by comparison with thermal modeling.

[1]  M. T. Boyle Low speed wind tunnel testing , 1988, Fourth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium.

[2]  Kenneth E. Torrance,et al.  Effects of package orientation and mixed convection on heat transfer from a PQFP , 1997 .

[3]  Kenneth E. Torrance,et al.  Efficient Heat Transfer Approximation for the Chip-on-Substrate Problem , 1996 .

[4]  B. Joiner,et al.  Use of experimental data in guiding thermal specification development , 1996, Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings.

[5]  S. J. Kline,et al.  Describing Uncertainties in Single-Sample Experiments , 1953 .