Evaluation ofFatigue Strength forSolder Joints after Thermal Aging

Recently, preventing environmental pollutions, leadfree(Pb-free) solders areabout toreplace tin-lead(Sn-Pb) eutectic solders. Sn-Ag-Cu alloys areleading candidates for leadfree solders. Inthis study, wecarried outboard level fatigue tests andinvestigated thefatigue life ofseveral lead free solder joints. Also, theeffects ofpadfinish metals and their thickness wereinvestigated.

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