Studies on the heat removal features of stacked SOI structures with a dedicated field solver program (SUNRED)

This paper gives the latest results of our studies on the thermal behaviour of SOI structures. The influence of changing certain geometrical parameters of the structure on the thermal properties was examined. A new two-dimensional field solver program was developed to achieve better accuracy which also made heat flow visualization possible.

[1]  H. Baltes,et al.  Process-dependent Thermophysical Properties Of CMOS IC Thin Films , 1995, Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95.

[2]  Márta Rencz,et al.  Fast field solvers for thermal and electrostatic analysis , 1998, Proceedings Design, Automation and Test in Europe.

[3]  Richard Barrett,et al.  Templates for the Solution of Linear Systems: Building Blocks for Iterative Methods , 1994, Other Titles in Applied Mathematics.

[4]  B. Hofflinger,et al.  Design considerations for high-performance low-power silicon-on-insulator gate arrays , 1995, Proceedings of the IEEE 1995 Custom Integrated Circuits Conference.

[5]  Wen Wang,et al.  Chip Substrate Resistance Modeling Technique for Integrated Circuit Design , 1984, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.