A highly reliable self-planarizing low-k intermetal dielectric for sub-quarter micron interconnects
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M. Hirayama | I. Tottori | K. Goto | M. Matsuura | K. Maekawa | Y. Mashiko
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[2] Y. Homma,et al. Low capacitance multilevel interconnection using low-/spl epsi/ organic spin-on glass for quarter-micron high-speed ULSIs , 1995, 1995 Symposium on VLSI Technology. Digest of Technical Papers.