High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer

In this work we present a novel technique to fabricate embedded 3D MIM capacitor on Si interposer showing capacitance densities as high as 96 nF/mm2 and low leakage current of 1.5 pA/nF, while having a breakdown voltage of 10.5 V and > 10 years lifetime (T50%@1V, 100 ˚C = 5.18e16 s).

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