핀-휜 형상에 따른 전자기기의 공기냉각 열전달성능의 영향

In present study, the effect of shapes of pin-fins of an air cooling module on the heat transfer performance for electronic packaging applications was numerically investigated. The types of pin-fin cross-sectional shapes considered in this study were ellipse and wing, and the circle shape was used as a reference. They have the same cross-sectional areas and the same heights, but they have the different surface areas. As the results, the surface area, the heat transfer coefficient, and the heat transfer performance of pin-fins greatly depend on their shapes. Of the three types(i. e, ellipse, wing, and circle) of pin-fins, the wing type fin with suitable shape produced the best heat transfer performance which was expressed as -hA s . This result implies that the cooling capacity of the pin-fin heat sink can be enhanced by the only shape changing without increasing air flow-rate or fin density.