Reliability modeling of mixtures of one-shot units under thermal cyclic stresses

Abstract Modeling components’ thermal fatigue life due to cyclic temperature fluctuation based on Coffin–Mason principle has been extensively investigated. However, sparse research assesses the thermal fatigue life by providing the reliability metrics of components/systems under thermal fatigue. The Birnbaum–Saunders (BS) distribution is developed to model the unit's fatigue failure induced by mechanical stresses and provides the unit's reliability metrics. In this paper, we investigate a generalized Birnbaum–Saunders (GBS) distribution and its performance in predicting fatigue failure caused by thermal cyclic stresses. We then apply the GBS distribution to model the reliability metrics of a system with mixtures of nonhomogeneous one-shot units subject to thermal fatigue. An extensive simulation model is developed to validate the system reliability metrics accuracy. Numerical examples are presented to illustrate the use of the models.

[1]  A. Desmond.  Stochastic models of failure in random environments , 1985 .

[2]  Jue Li,et al.  Reliability of Lead-Free Solder Interconnections in Thermal and Power Cycling Tests , 2009, IEEE Transactions on Components and Packaging Technologies.

[3]  Yao Cheng.  A General Birnbaum-Saunders Model and its Application in ALT Models , 2013 .

[4]  Wang Chunhui,et al.  A concept for PHM system for storage and life extension of tactical missile , 2014, 2014 Prognostics and System Health Management Conference (PHM-2014 Hunan).

[5]  Hongtao Ma,et al.  Reliability of Lead-Free Solder Joints Under a Wide Range of Thermal Cycling Conditions , 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[7]  Yuan Zhang,et al.  Determination of Acceleration Factor in Predicting the Field Life of Plated Through Holes From Thermal Stress Data , 2008, IEEE Transactions on Components and Packaging Technologies.

[8]  Herbert D. Peckham.  Problems in Sensitivity Testing of "One Shot" Electro-Explosive Devices , 1965, IEEE Transactions on Aerospace.

[9]  Robert Darveaux,et al.  Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction , 2002 .

[10]  Soon-Bok Lee,et al.  A Study on the Thermal Fatigue Behavior of Solder Joints Under Power Cycling Conditions , 2008, IEEE Transactions on Components and Packaging Technologies.

[11]  Reza Ghaffarian,et al.  Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP Assemblies , 2000 .

[12]  Xuejun Fan,et al.  An acceleration model for lead-free (SAC) solder joint reliability under thermal cycling , 2008, 2008 58th Electronic Components and Technology Conference.

[13]  B.G. Sammakia,et al.  Effect of geometry and temperature cycle on the reliability of WLCSP solder joints , 2005, IEEE Transactions on Components and Packaging Technologies.

[14]  Yan Qi,et al.  Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints , 2006, Microelectron. Reliab..

[15]  Arthur Fries,et al.  Fatigue Failure Models ߝ Birnbaum-Saunders vs. Inverse Gaussian , 1982, IEEE Transactions on Reliability.

[16]  Z. Birnbaum,et al.  A new family of life distributions , 1969 .

[17]  Yao Cheng,et al.  Reliability Modeling and Prediction of Systems With Mixture of Units , 2016, IEEE Transactions on Reliability.

[18]  H. Reichl,et al.  Reliability assessment of flip-chip assemblies with lead-free solder joints , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

[19]  Haiyu Qi,et al.  A Rapid Life-Prediction Approach for PBGA Solder Joints Under Combined Thermal Cycling and Vibration Loading Conditions , 2009, IEEE Transactions on Components and Packaging Technologies.

[20]  Martin Newby.  Monitoring and maintenance of spares and one shot devices , 2008, Reliab. Eng. Syst. Saf..

[21]  Michael Osterman,et al.  Strain-Range-Based Solder Life Predictions Under Temperature Cycling With Varying Amplitude and Mean , 2014, IEEE Transactions on Device and Materials Reliability.

[22]  J. McPherson.  Reliability Physics and Engineering , 2010 .

[23]  Lei Han,et al.  Research on Bayesian approach for storage reliability assessment of missile-engine , 2011, The Proceedings of 2011 9th International Conference on Reliability, Maintainability and Safety.

[24]  Donald Schatzel,et al.  Electronic Packaging Materials for Extreme, Low Temperature, Fatigue Environments , 2010, IEEE Transactions on Advanced Packaging.

[25]  Debasis Kundu,et al.  On the hazard function of Birnbaum-Saunders distribution and associated inference , 2008, Comput. Stat. Data Anal..

[26]  Sidharth,et al.  Board level solder reliability versus ramp rate and dwell time during temperature cycling , 2003 .

[27]  Tsai-Hung Fan,et al.  The Bayesian approach for highly reliable electro-explosive devices using one-shot device testing , 2009 .

[28]  F. X. Che,et al.  Fatigue Reliability Analysis of Sn–Ag–Cu Solder Joints Subject to Thermal Cycling , 2013, IEEE Transactions on Device and Materials Reliability.

[29]  Nick Bosco,et al.  The Influence of PV Module Materials and Design on Solder Joint Thermal Fatigue Durability , 2016, IEEE Journal of Photovoltaics.