New 3-D Design of Filtering Components Using Multilayer Board Technologies

In this paper, a contribution to development of three-dimensional (3-D) techniques using multilayer boards for design of passive circuit components is presented. Shown approach gives a possibility to obtain compact devices with an improved EMI performance. A distinguishing point of this approach is a shield via structure which serves as both a vertical transmission line and an appropriate element of a passive such as short- or open-circuited stub, as for an example. Here bandpass and bandstop filters designed by the use of stub elements obtained as a part of the shield via structure are demonstrated. Simulation and measurement data obtained for the filters demonstrate a high performance of such components and a perspective direction in development of compact and cost-effective devices.