Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint
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Kimihiro Yamanaka | Kiju Lee | Katsuaki Suganuma | Keun-Soo Kim | Minoru Ueshima | Yutaka Tsukada | Soichi Kuritani | K. Suganuma | Keun-Soo Kim | Y. Tsukada | Kiju Lee | K. Yamanaka | M. Ueshima | Soichi Kuritani
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