An Overview of System in Package (SiP) Applications and Technologies for CPU and Communications Systems

Research and development on System in Package (SiP) technologies is prevalent now both in industry and academia. This paper provides an overview of SiP from a CPU and communications systems perspective. Some of the items that will be covered include what defines a “system” for SiP, what value a SiP architecture brings, the types of SiP packaging architectures and technologies, and the challenges involved with developing SiP solutions.Copyright © 2005 by ASME