An Overview of System in Package (SiP) Applications and Technologies for CPU and Communications Systems
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Research and development on System in Package (SiP) technologies is prevalent now both in industry and academia. This paper provides an overview of SiP from a CPU and communications systems perspective. Some of the items that will be covered include what defines a “system” for SiP, what value a SiP architecture brings, the types of SiP packaging architectures and technologies, and the challenges involved with developing SiP solutions.Copyright © 2005 by ASME