Performance improvement using on-board wires for on-chip interconnects
暂无分享,去创建一个
[1] Payman Zarkesh-Ha,et al. Prediction of net-length distribution for global interconnects in a heterogeneous system-on-a-chip , 2000, IEEE Trans. Very Large Scale Integr. Syst..
[2] James D. Meindl,et al. Optimal printed wiring board design for high I/O density chip size packages , 1999 .
[3] James D. Meindl,et al. Low cost high density Compliant Wafer Level Package , 2000 .
[4] Kevin P. Martin,et al. An analysis of the gap between PWB technology and chip I/O interconnect technology, and a new wafer-level batch packaging concept , 1999 .
[5] E. J. Rymaszewski,et al. Microelectronics Packaging Handbook , 1988 .
[6] P. Zarkesh-Ha,et al. Stochastic net length distributions for global interconnects in a heterogeneous system-on-a-chip , 1998, 1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216).