Thermal design considerations for 12kV SiC n-IGBT based 3L NPC converter

Transformer less Intelligent Power Substation (TIPS) is a solid state replacement for the conventional bulky distribution transformers used for 13.8kV and 480V grid interconnectivity. A 100kVA 3L NPC converter is being built using 12kV SiC n-IGBT for the high voltage grid interface. In this paper, detailed thermal behavior of this converter is studied for optimum thermal design. The thermal profile at the die level at different power factor of operation is studied. This study helps the optimum component placement in the converter. Also it shows that the operating modes of the converter play a key role in optimum thermal design.

[1]  H. A. Nienhaus,et al.  A solid state transformer , 1980, 1980 IEEE Power Electronics Specialists Conference.

[2]  Seo Young Kim,et al.  Analysis of Convective Thermal Resistance in Ducted Fan-Heat Sinks , 2006, IEEE Transactions on Components and Packaging Technologies.

[3]  Subhashish Bhattacharya,et al.  Transformer less Intelligent Power Substation design with 15kV SiC IGBT for grid interconnection , 2011, 2011 IEEE Energy Conversion Congress and Exposition.

[4]  E. Santi,et al.  Expanded Thermal Model for IGBT Modules , 2006, Conference Record of the 2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting.

[5]  Alex Q. Huang,et al.  Comparisons of 6.5kV 25A Si IGBT and 10-kV SiC MOSFET in Solid-State Transformer application , 2010, 2010 IEEE Energy Conversion Congress and Exposition.

[6]  Srdjan Lukic,et al.  Performance evaluation of solid state transformer based microgrid in FREEDM systems , 2011, 2011 Twenty-Sixth Annual IEEE Applied Power Electronics Conference and Exposition (APEC).

[7]  Jih-Sheng Lai,et al.  Multilevel intelligent universal transformer for medium voltage applications , 2005, Fourtieth IAS Annual Meeting. Conference Record of the 2005 Industry Applications Conference, 2005..

[8]  Issam Mudawar.  Assessment of high-heat-flux thermal management schemes , 2001 .

[9]  Yue-Tzu Yang,et al.  Numerical study of pin-fin heat sink with un-uniform fin height design , 2008 .

[10]  S. Bhattacharya,et al.  Development of a predictive observer thermal model for power semiconductor devices for overload monitoring in high power high frequency converters , 2012, 2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC).

[11]  Jun Wang,et al.  Characterization, Modeling, and Application of 10-kV SiC MOSFET , 2008, IEEE Transactions on Electron Devices.

[12]  A. Bar-Cohen,et al.  Bypass effect in high performance heat sinks , 2000 .

[13]  Jun Wang,et al.  270 kVA Solid State Transformer Based on 10 kV SiC Power Devices , 2007, 2007 IEEE Electric Ship Technologies Symposium.

[14]  David E. Grider,et al.  10 kV, 120 A SiC half H-bridge power MOSFET modules suitable for high frequency, medium voltage applications , 2011, 2011 IEEE Energy Conversion Congress and Exposition.

[15]  Alex Q. Huang,et al.  Voltage and power balance control for a cascaded multilevel solid state transformer , 2010, 2010 Twenty-Fifth Annual IEEE Applied Power Electronics Conference and Exposition (APEC).

[16]  William A. Sethares,et al.  Thermal parameter estimation using recursive identification , 1991 .