Control of IGBT junction temperature in small-scale wind power converter

In wind power converters, the junction temperature of the power module is the crucial factor which affects its reliability. This paper developed a comprehensive thermal management strategy to improve the operational reliability of a small-scale wind power converter. Theoretical analysis, simulation and frequency conversion experiment are given to verify the effectiveness. And the specific goal of thermal management has also been investigated. Firstly, the idea of thermal management which combines the reliability as well as the stability is introduced. Then, in order to smooth the temperature fluctuations, the flexible continuous adjustment of the switching frequency and the exterior thermal management method are applied. A FPGA based temperature-controlled oscillator and fan speed regulator are designed. Lastly, numerical simulation was carried out to verify the correctness of the proposed thermal smooth control method. Meanwhile, the rain-flow counting method and Miner's linear cumulative damage law are applied to check whether the goal is achieved or not, from the system reliability point of view. This study shows that the thermal management is not mean only to suppress the fluctuation of the IGBT junction temperature as much as possible. But full consideration should be given for both the temperature fluctuation as well as its average value, so as to improve the reliability and to extend the lifetime of the power converter.

[1]  Andoni Urtasun,et al.  Modeling of small wind turbines based on PMSG with diode bridge for sensorless maximum power tracking , 2013 .

[2]  Lixiang Wei,et al.  Analysis of PWM frequency control to improve the lifetime of PWM inverter , 2009, 2009 IEEE Energy Conversion Congress and Exposition.

[3]  Peter Tavner,et al.  Condition Monitoring for Device Reliability in Power Electronic Converters: A Review , 2010, IEEE Transactions on Power Electronics.

[4]  Xu Cai,et al.  Thermal smooth control for Multi-MW parallel wind power converter , 2013, 2013 IEEE International Conference of IEEE Region 10 (TENCON 2013).

[5]  Jian Feng Li,et al.  Unusual Observations in the Wear-Out of High-Purity Aluminum Wire Bonds Under Extended Range Passive Thermal Cycling , 2010, IEEE Transactions on Device and Materials Reliability.

[6]  G. Nicoletti,et al.  Fast power cycling test of IGBT modules in traction application , 1997, Proceedings of Second International Conference on Power Electronics and Drive Systems.

[7]  Robert D. Lorenz,et al.  Active thermal control of power electronics modules , 2003 .

[8]  Janne Kiilunen,et al.  Reliability analysis of two frequency converter generations using system-level stress testing , 2012 .

[9]  Volker Pickert,et al.  Power electronic device temperature estimation and control in pulsed power and converter applications , 2008 .

[10]  V. Blasko,et al.  On line thermal model and thermal management strategy of a three phase voltage source inverter , 1999, Conference Record of the 1999 IEEE Industry Applications Conference. Thirty-Forth IAS Annual Meeting (Cat. No.99CH36370).

[11]  Jorg Roth-Stielow,et al.  Lifetime as a control variable in power electronic systems , 2010, 2010 Emobility - Electrical Power Train.

[12]  Petar Igic,et al.  High-speed electro-thermal simulation model of inverter power modules for hybrid vehicles , 2011 .

[13]  Dawei Xiang,et al.  An Industry-Based Survey of Reliability in Power Electronic Converters , 2011, IEEE Transactions on Industry Applications.

[14]  Lixiang Wei,et al.  Analysis of IGBT power cycling capabilities used in Doubly Fed Induction Generator wind power system , 2010, 2010 IEEE Energy Conversion Congress and Exposition.

[15]  Du Mingxing,et al.  Study of Bonding Wire Failure Effects on External Measurable Signals of IGBT Module , 2014, IEEE Transactions on Device and Materials Reliability.

[16]  J.A. Ferreira,et al.  Design Techniques for Thermal Management in Switch Mode Converters , 2006, IEEE Transactions on Industry Applications.

[17]  J Gowar,et al.  Power Semiconductor Devices: Theory and Applications , 1999 .

[18]  Mohammad Tariq Iqbal,et al.  Reliability analysis of grid connected small wind turbine power electronics , 2009 .

[19]  Jorg Roth-Stielow,et al.  Chances and limits of a thermal control for a three-phase voltage source inverter in traction applications using permanent magnet synchronous or induction machines , 2011, Proceedings of the 2011 14th European Conference on Power Electronics and Applications.

[20]  D.A. Murdock,et al.  Active thermal control of power electronic modules , 2003, IEEE Transactions on Industry Applications.

[21]  Liao Mei-ying Losses calculation of IGBT module and heat dissipation system design of inverters , 2011 .

[22]  C Mark Johnson,et al.  Real-Time Compact Thermal Models for Health Management of Power Electronics , 2010, IEEE Transactions on Power Electronics.