Design envelopes and optical feature extraction techniques for survivability of SnAg leadfree packaging architectures under shock and vibration

In this paper, a design-envelope approach based on optical feature extraction techniques has been investigated for drop and shock survivability of electronic packaging has been presented for 6-leadfree solder alloy systems. Solder alloy systems investigated include, Sn1Ag0.5Cu, Sn3Ag0.5Cu, Sn0.3Ag0.7Cu, Sn0.3Ag0.7Cu0.1Bi, Sn0.2Ag0.7Cu0.1Bi- 0.1Ni, 96.5Sn3.5Ag. Previously, digital image correlation (DIC) has been used for measurement of thermally-induced deformation and material-characterization. In this paper, DIC has been used for transient dynamic measurements, and optical feature extraction. Board assemblies have been subjected to shock-impact in various orientations including the JEDEC zero-degree drop and the vertical free-drop. Transient deformation has been measured using both digital image correlation and the strain gages. Measurements have been taken on both the package and the board side of the assemblies. Accuracy of high-speed optical measurement has been compared with that from discrete strain gages. Package architectures examined include-flex ball-grid arrays, tape-array ball-grid arrays, and metal lead-frame packages. Explicit finite-element models have been developed and correlated with experimental data. Models developed include, smeared property models, Timoshenko-beam models, and explicit sub-models. The potential of damage identification and tracking for various solder alloys has been investigated. Data on identification of damage proxies for competing failure mechanisms at the copper-to-solder, solder-to-printed circuit board, and copper-to-package substrate has been presented. Design envelopes have been developed based on statistical pattern recognition. The design-envelope is intended for component integration to ensure survivability in shock and vibration environments at a user-specified confidence level.

[1]  J. Tukey,et al.  An algorithm for the machine calculation of complex Fourier series , 1965 .

[2]  Peter D. Welch,et al.  Fast Fourier Transform , 2011, Starting Digital Signal Processing in Telecommunication Engineering.

[3]  Peter D. Welch,et al.  Historical notes on the fast Fourier transform , 1967 .

[4]  Sunlight speckle photography , 1993 .

[5]  Ka-Ming Lau,et al.  Climate Signal Detection Using Wavelet Transform: How to Make a Time Series Sing , 1995 .

[6]  Jeffrey D. Helm,et al.  Improved three-dimensional image correlation for surface displacement measurement , 1996 .

[7]  S. Santoso,et al.  Power quality assessment via wavelet transform analysis , 1996 .

[8]  H. Ho,et al.  Application of moire interferometry in electronics packaging , 1997, Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307).

[9]  Metin Akay,et al.  Wavelet applications in medicine , 1997 .

[10]  Amy E. Bell,et al.  New image compression techniques using multiwavelets and multiwavelet packets , 2001, IEEE Trans. Image Process..

[11]  M. S. Dadkhah,et al.  Whole field displacement measurement technique using speckle interferometry , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

[12]  Peng Zhou,et al.  Methodology for predicting solder joint reliability in semiconductor packages , 2002, Microelectron. Reliab..

[13]  Paul S. Ho,et al.  Thermal deformation analysis on flip-chip packages using high resolution moire interferometry , 2002, ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).

[14]  Liping Zhu,et al.  Modeling technique for reliability assessment of portable electronic product subjected to drop impact loads , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[15]  J. E. Field,et al.  Tackling the Drop Impact Reliability of Electronic Packaging , 2003 .

[16]  D. Amodio,et al.  Digital speckle correlation for strain measurement by image analysis , 2003 .

[17]  Dongji Xie,et al.  Solder joint behavior of area array packages in board level drop for handheld devices , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[18]  Yu Fu,et al.  Wavelets and singularities in bearing vibration signals , 2003, Proceedings of the 2003 International Conference on Machine Learning and Cybernetics (IEEE Cat. No.03EX693).

[19]  P. Geng,et al.  Mechanical shock testing and modeling of PC motherboards , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

[20]  Y. Mui,et al.  Impact of substrate finish on Sn/Ag/Cu alloy solder joint , 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).

[21]  T. Baughn,et al.  High Resolution Characterization of Materials Used in Packages Through Digital Image Correlation , 2005 .

[22]  P. Lall,et al.  Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging , 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

[23]  L. Kehoe,et al.  Measurement of deformation and strain in first level C4 interconnect and stacked die using optical digital image correlation , 2006, 56th Electronic Components and Technology Conference 2006.

[24]  P. Lall,et al.  Solder-joint reliability in electronics under shock and vibration using explicit finite-element sub-modeling , 2006, 56th Electronic Components and Technology Conference 2006.

[25]  Xunqing Shi,et al.  Thermal Deformation Measurement by Digital Image Correlation Method , 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

[26]  X.Q. Shi,et al.  Effect of Loading Mode, Temperature and Moisture on Interface Fracture Toughness of Silicon/Underfill/Silicon Sandwiched System , 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

[27]  Hugo Sol,et al.  Full-field optical measurement for material parameter identification with inverse methods , 2006 .

[28]  R. Pandher,et al.  Drop Shock Reliability of Lead-Free Alloys - Effect of Micro-Additives , 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

[29]  K. Hemker,et al.  Thermal Expansion Measurements on Coating Materials by Digital Image Correlation , 2007 .

[30]  Hyunchul Kim,et al.  Improved Drop Reliability Performance with Lead Free Solders of Low Ag Content and Their Failure Modes , 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

[31]  Timothy J. Miller,et al.  High-speed DIC Data Analysis from a Shaking Camera Syste. , 2007 .

[32]  N. Lee,et al.  A Compliant and Creep Resistant SAC-Al(Ni) Alloy , 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

[33]  B. Nandagopal,et al.  Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints , 2008, IEEE Transactions on Components and Packaging Technologies.

[34]  Pradeep Lall,et al.  High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics , 2009 .