Structures and Characterizations of TiVCr and TiVCrZrY Films Deposited by Magnetron Sputtering under Different Bias Powers

In this study, TiVCr and TiVCrZrY films were deposited on Si substrates by magnetron sputtering with the application of radio-frequency substrate bias of different powers from 0 to 15 W. The crystal structures, microstructure, and mechanical, electrical, and optical properties under the effect of bias were characterized. Both the TiVCr and TiVCrZrY films constructed simple solid solutions from all alloyed elements. The TiVCr films possessed a body-centered cubic crystal structure with a pyramid-like surface, while the TiVCrZrY films had a hexagonal close-packed crystal structure with a domelike surface. The microstructure and properties of the films varied with bias power. As the bias power increased, the microstructure of the films obviously changed from a porous to a dense columnar feature, and the density of the voids existing between the columns decreased. Accordingly, the physical properties of the films were improved. The hardness of the TiVCr and TiVCrZrY films was enhanced to about 11 and 14 GPa, and the electrical resistivity was lowered to 80 and 100 μΩ cm, respectively.

[1]  L. Toth Transition Metal Carbides and Nitrides , 1971 .

[2]  S. Barnett,et al.  Bias Sputter Deposition of Dense Yttria‐Stabilized Zirconia Films on Porous Substrates , 1995 .

[3]  Atomic-scale modeling of low-energy ion-solid processes , 1988 .

[4]  O. Kraft,et al.  Solid solution alloy effects on microstructure and indentation hardness in Pt-Ru thin films , 2001 .

[5]  D. Shoesmith,et al.  Modeling the Failure of Nuclear Waste Containers , 1997 .

[6]  Jong-Kuek Park,et al.  Grain size refinement of the diamond film deposited on the WC–Co cutting inserts using direct current biasing , 2003 .

[7]  J. Wang,et al.  Reduction of Ru Underlayer Thickness for CoCrPt–SiO$_2$Perpendicular Recording Media , 2006, IEEE Transactions on Magnetics.

[8]  Ramesh Chandra,et al.  Influence of the sputtering gas on the preferred orientation of nanocrystalline titanium nitride thin films , 2002 .

[9]  F. Shieu,et al.  Influence of radio frequency bias on the characteristics of TiO2 thin films prepared by DC sputtering , 2006 .

[10]  A. Korhonen,et al.  Plasma nitriding and ion plating with an intensified glow discharge , 1983 .

[11]  M. Zlatanović,et al.  Effect of plasma nitriding on the properties of (Ti, Al)N coatings deposited onto hot work steel substrates , 1993 .

[12]  T. Shun,et al.  Nanostructured High‐Entropy Alloys with Multiple Principal Elements: Novel Alloy Design Concepts and Outcomes , 2004 .

[13]  C. C. Wang,et al.  Characterization of AlN Thin Films Prepared by Unbalanced Magnetron Sputtering , 2004 .

[14]  E. Pascual,et al.  Effect of ion bombardment on the properties of B 4 C thin films deposited by RF sputtering , 1999 .

[15]  A. Madan,et al.  Mechanical properties and thermal stability of TiN∕TiB2 nanolayered thin films , 2005 .

[16]  K. Pfaffinger,et al.  Structure and Strength Effects in CVD Titanium Carbide and Titanium Nitride Coatings , 1976 .

[17]  R. Lin,et al.  Sputter-deposited nanocrystalline Cr and CrN coatings on steels , 2001 .

[18]  L. Alexander,et al.  X-Ray diffraction procedures for polycrystalline and amorphous materials , 1974 .

[19]  Ching-Tung Hsu,et al.  The Effect of Boron on the Corrosion Resistance of the High Entropy Alloys Al0.5CoCrCuFeNiB x , 2007 .

[20]  H. Makita,et al.  Reducing the grain size for fabrication of nanocrystalline diamond films , 2001 .

[21]  Ray Y. Lin,et al.  Amorphous molybdenum nitride thin films prepared by reactive sputter deposition , 2004 .

[22]  C. Eggs,et al.  Investigation of stored energy in plasma deposited TiNx films , 1997 .

[23]  D. Shoesmith,et al.  Hydrogen Absorption and the Lifetime Performance of Titanium Nuclear Waste Containers , 2000 .

[24]  A. K. Suri,et al.  Influence of the Ar/N2 ratio on the preferred orientation and optical reflectance of reactively sputter deposited titanium nitride thin films , 2003 .

[25]  B. Chapman,et al.  Glow Discharge Processes: Sputtering and Plasma Etching , 1980 .

[26]  Jia-Hong Huang,et al.  Effect of substrate bias on the structure and properties of ion-plated ZrN on Si and stainless steel substrates , 2003 .

[27]  F. Shieu,et al.  Characterization and Formation Mechanism of Macroparticles in Arc Ion-Plated CrN Thin Films , 2003 .

[28]  R. Boyer An overview on the use of titanium in the aerospace industry , 1996 .

[29]  J. Sivertsen,et al.  Effects of RF bias on the texture, magnetics, and recording properties of RF sputtered CoCr/Cr longitudinal thin film media , 1990 .

[30]  Choong-Nyeon Park,et al.  Hydrogen absorption–desorption characteristics of Ti(0.22 + X)Cr(0.28 + 1.5X)V(0.5 − 2.5X) (0 ≤ X ≤ 0.12) alloys , 2005 .

[31]  J. Dutkiewicz,et al.  Effect of Mechanical Alloying on Structure and Hardness of TiAl-V Powders , 2004 .

[32]  Jiecai Han,et al.  Effects of mass density on the microhardness and modulus of tetrahedral amorphous carbon films , 2007 .

[33]  Marcus Textor,et al.  Titanium in Medicine : material science, surface science, engineering, biological responses and medical applications , 2001 .

[34]  J. Thornton The microstructure of sputter-deposited coatings , 1986 .

[35]  G. Libowitz,et al.  Hydride formation rates of titanium-based b.c.c. solid solution alloys☆ , 1984 .

[36]  D. Lee,et al.  Influence of sputtering parameters on microstructure and morphology of TiO2 thin films , 2002 .