论文信息 - Die-to-Wafer 3D Interconnections Operating at Sub-Kelvin Temperatures for Quantum Computation - 字舞流文

Die-to-Wafer 3D Interconnections Operating at Sub-Kelvin Temperatures for Quantum Computation

M. Vinet | F. Fournel | J. Charbonnier | T. Meunier | M. Urdampilleta | N. Bresson | R. Franiatte | V. Thiney | A. Garnier | C. Thomas | S. Renet | N. David