Die-to-Wafer 3D Interconnections Operating at Sub-Kelvin Temperatures for Quantum Computation
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M. Vinet | F. Fournel | J. Charbonnier | T. Meunier | M. Urdampilleta | N. Bresson | R. Franiatte | V. Thiney | A. Garnier | C. Thomas | S. Renet | N. David